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Journal of Vacuum Science and Technology B

Volumn 28, Issue 6, 2010, Pages

Plasma etch fabrication of 60:1 aspect ratio silicon nanogratings with 200 nm pitch

(6) Mukherjee, Pran a Bruccoleri, Alexander a Heilmann, Ralf K a Schattenburg, Mark L a Kaplan, Alex F b Guo, L Jay b

a MASSACHUSETTS INSTITUTE OF TECHNOLOGY (United States)

b UNIVERSITY OF MICHIGAN (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; DIFFRACTION GRATINGS; DRY ETCHING; REACTIVE ION ETCHING; SILICON COMPOUNDS; SILICON OXIDES;

ASPECT-RATIO; DEEP REACTIVE ION ETCHING; DEEP REACTIVE-ION ETCHINGS; DRY ETCH PROCESS; HALF-PITCH GRATINGS; HARDMASKS; INTERFERENCE LITHOGRAPHY; MULTI-STAGES; NANOGRATING; PATTERN TRANSFERS;

X RAY DIFFRACTION;

EID: 84905947338 PISSN: 21662746 EISSN: 21662754 Source Type: Journal
DOI: 10.1116/1.3507427 Document Type: Article

Times cited : (31)

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