Stress of electroless copper deposits on insulating and metal substrates

Thin Solid Films

Volumn 565, Issue , 2014, Pages 136-142

  Brüning, Ralf ^a   Sibley, Allison ^a   Sharma, Tanu ^a   Brown, Delilah A ^a   Demay, Thibault ^a   Brüning, Frank ^b   Bernhard, Tobias ^b  

^a MOUNT ALLISON UNIVERSITY   (Canada)

^b ATOTECH DEUTSCHLAND GMBH   (Germany)

Author keywords

Electroless copper; In situ strain monitoring; Internal strain; X ray diffraction

Indexed keywords

BINARY ALLOYS; COPPER ALLOYS; COPPER DEPOSITS; COPPER METALLOGRAPHY; INSULATION; IRON ALLOYS; IRON METALLOGRAPHY; NICKEL METALLOGRAPHY; PRINTED CIRCUIT BOARDS; STYRENE; X RAY DIFFRACTION;

ACRYLONITRILE BUTADIENE STYRENE; DATA CORRECTION METHODS; ELECTROLESS COPPER; IN-SITU STRAINS; INSULATING SUBSTRATES; INTERNAL STRAINS; OPERATING TEMPERATURE; THERMAL CONTRACTION;

SUBSTRATES;

EID: 84905720884     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2014.07.006     Document Type: Article

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