Non-destructive wafer recycling for low-cost thin-film flexible optoelectronics

Advanced Functional Materials

Volumn 24, Issue 27, 2014, Pages 4284-4291

  Lee, Kyusang ^a   Zimmerman, Jeramy D ^a   Hughes, Tyler W ^a   Forrest, Stephen R ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

cold weld bonding; epitaxial lift off; flexible thin film electronics; III V optoelectronics; wafer reuse

Indexed keywords

COSTS; FLEXIBLE ELECTRONICS; LIGHT EMITTING DIODES; MESFET DEVICES; PHOTOVOLTAIC CELLS; RECYCLING; SEMICONDUCTOR GROWTH; SILICON WAFERS; SUBSTRATES;

CHEMO-MECHANICAL POLISHING; COMMERCIAL APPLICATIONS; COMPOUND SEMICONDUCTORS; EPITAXIAL LIFTOFF; FLEXIBLE OPTOELECTRONICS; III-V OPTOELECTRONICS; METAL SEMICONDUCTORS; WAFER REUSE;

WAFER BONDING;

EID: 84904548546     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201400453     Document Type: Article

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