Electroless plating for protection against wear

Surface Coatings for Protection Against Wear

Volumn , Issue , 2006, Pages 184-225

  De León, C Ponce ^a   Kerr, C ^b   Walsh, F C ^a  

^a UNIVERSITY OF SOUTHAMPTON   (United Kingdom)

^b Tin Technology Ltd   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CONDENSED MATTER PHYSICS; SURFACES;

ELECTROLESS PLATING;

EID: 84904076055     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1533/9781845691561.184     Document Type: Chapter

References (88)

1. Parkinson R. Properties and Applications of Electroless Nickel 1997, Nickel Development Institute, Ottawa, Ontario, Nickel Development Institute Technical Series 10081.
2. Baudrand D.W. Autocatalytic (electroless) plating on aluminium. Plating Surf. Finishing 1979, 66(12):14-17.
3. Duncan R.N. Corrosion control with electroless nickel coatings. Proceedings of the AES Electroless Plating Symposium 1982, 7. American Electroplaters Society, East Orange, New Jersey.
4. Yung E.Y., Romankiw L.T., Alkire R.C. Plating into through-holes and blind holes. J. Electrochem. Soc 1989, 136(1):206-215.
5. Okinawa Y., Hoshino M. Some recent topics in gold plating for electronics applications. Gold Bull 1998, 31(1):3-13.
6. Bhatgadde L.G. A review of electroless plating techniques for electronics. Trans. Metal Finishing Assoc. India 1997, 6(3):229-233.
7. Baudrand D. Electroless processes. Plating Surf. Finishing 2004, 91(8):19-20.
8. Dubin V.M., Lopatin S., Kohn A., Petrov N., Elzenberg M., Shacham-Diamand Y. Microelectronic Packaging, New Trends Electrochemical Technology, Vol. 3 2005, 65-110. Taylor & Francis, London, 'Electroless barrier and seed layers for on-chip metallization'.
9. Kato M., Okinaka Y. Some recent developments in non-cyanide gold plating for electronics applications. Gold Bull 2004, 37(1-2):37-44.
10. Petrova M. Chemical deposition of metal composite coatings on plastics. Trans. Inst. Metal Finishing 2004, 82(1-2):43-50.
11. Agarwala R.C., Agarwala V. Electroless alloy/composite coatings: a review. Sadhana 2003, 28(3-4):475-493.
12. Djokic S.S. Modern Aspects of Electrochemistry, Vol. 35 2002, 51-133. Kluwer, New York, 'Electroless deposition of metals and alloys'. B.E. Conway, R.E. White (Eds.).
13. O'sullivan E.J. Fundamental and practical aspects of the electroless deposition reaction. Adv. Electrochem. Sci. Engng 2001, 7:225-273.
14. Duncan R.N. Electroless nickel: past, present and future. Proceedings of the AESF Annual International Technical SUR/FIN 2000 Conference 2000, 880-890. American Electroplaters and Surface Finishers Society, Orlando, Florida.
15. Kerr C., Barker D., Walsh F. Electroless deposition of metals. Trans. Inst. Metal Finishing 2001, 79(1):41-46.
16. Wen G., Guo Z.X., Davies C.K.L. Electroless plating for the enhancement of material performance. Mater. Technol 1999, 4(4):210-217.
17. Khoperia T.N. Microfabrication of microdevices by electroless deposition. Electrochemical Processing in ULSI Fabrication and Semiconductor/Metal Deposition II, Proceedings of the Electrochemical Society, Vol. 99-9 1999, 352-360. Electrochemical Society, Pennington, New Jersey.
18. Kikuchi E., Nemoto Y., Kajiwara M., Uemiya S., Kojima T. Steam reforming of methane in membrane reactors: comparison of electroless-plating and CVD membranes and catalyst packing modes. Catal. Today 2000, 56(1-3):75-81.
19. Berdondini L., van der Wal P.D., De Rooij N.F., Koudelka-Hep M. Development of an electroless post-processing technique for depositing gold as electrode material on CMOS devices. Sensors Actuators B 2004, 99(2-3):505-510.
20. Fouassiera O., Chazelas J., Silvain J.F. Conception of a consumable copper reaction zone for a NiTi/SnAgCu composite material. Composites Appl. Sci. Mf 2002, 33(10):1391-1395.
21. Huo H., Li Y., Wang F. Corrosion of AZ91D magnesium alloy with a chemical conversion coating and electroless nickel layer. Corros. Sci 2004, 46(6):1467-1477.
22. Kim J.W., Ryu J.H., Lee K.T., Oh S.M. Improvement of silicon powder negative electrodes by copper electroless deposition for lithium secondary batteries. J. Power Sources 2005, 147(1-2):227-233.
23. Chen X., Xia J., Peng J., Li W., Xie S. Carbon-nanotube metal-matrix composites prepared by electroless plating. Composites Sci. Technol 2000, 60(2):301-306.
24. Smoukov S.K., Bishop K.J.M., Campbell C.J., Grzybowski B.A. Freestanding three-dimensional copper foils prepared by electroless deposition on micropatterned gels. Adv. Mater 2005, 17(6):751-755.
25. Wurtz A. Ct. R. Acad. Sci 1844, 18:702-705.
26. Wurtz A. Ann. Chim. Phys 1846, 16:190-231.
27. Brenner A., Riddell G. Nickel plating on steel by chemical reduction. J. Res. Natn. Bur. Stand 1946, 37:31-34. RP1725.
28. Riedel W. Electroless Nickel Plating 1991, Finishing Publications Ltd, Stevenage, Hertfordshire.
29. Brenner A. Electroless plating comes of age - Part 1. Metal Finishing 1954, 52(11):68-76.
30. Brenner A. Electroless plating comes of age - Part 2. Metal Finishing 1954, 52(12):61-68.
31. Fratesi R., Ruffini N., Malavolta M., Bellezze T. Contemporary use of Ni and Bi in hot-dip galvanizing. Surf. Coat. Technol 2002, 157(1):34-39.
32. Swadzba L., Moskal G., Hetmanczyk M., Mendala B., Jarczyk G. Long-term cyclic oxidation of Al-Si diffusion coatings deposited by arc-PVD on TiAlCrNb alloy. Surf. Coat. Technol 2004, 184(1):93-101.
33. Choy K.L. Chemical vapour deposition of coatings. Prog. Mater. Sci 2003, 48(2):57-170.
34. Tjong S.C., Chen H. Nanocrystalline materials and coatings. Mater. Sci. Engng Rep 2004, R-45(1-2):1-88.
35. Gawrilov G.G. Chemical (Electroless) Nickel-plating 1979, Portcullis Press, Redhill, Surrey.
36. Barker B.D. Electroless deposition of metals. Trans. Inst. Metal Finishing 1993, 71(3):121-124.
37. Orchard S.W. Electroless plating. S. Afr. J. Chem 1987, 13(8):222-224.
38. Smith S.F. The mechanics of electroless nickel deposition. Metal Finishing 1979, 77:60-62.
39. Salvago G., Cavallotti P. Characteristics of the chemical reduction of nickel alloys with hypophosphite. Plating 1972, 59:665-671.
40. Shipley R.C. Historical highlights of electroless plating. Plating Surface Finishing 1984, 71(6):92-99.
41. Chen X., Xia J., Peng J., Li S., Xie S. Carbon-nanotube metal-matrix composites prepared by electroless plating. Composites Sci. Technol 2000, 60:301-306.
42. Durney L. Electroplating Engineering Handbook 1984, Van Nostrand Reinhold, New York. 4th edition.
43. Van Slyke D.D. On the measurement of buffer values and on the relationship of buffer values to the dissociation constant of the buffer and the concentration and reaction of the buffer solution. J. Biol. Chem 1922, 52:525-570.
44. El Mallah A.E., Saada M.Y. Plating rate of electroless nickel. Metal Finishing 1978, 76(11):62-65.
45. DeMinjer C.H., Brenner A. Studies on electroless nickel plating. Plating 1957, 12:1297-1305.
46. Talmey P., Gutzeit G. (11 September), 'Processes of chemical nickel plating and baths. US Patent 1956, 2(762):723.
47. Duncan R.N. Corrosion resistance of high phosphorus electroless coatings. Proceedings of the 3rd AESF Electroless Plating Symposium 1986, 1-39. American Electroplaters and Surface Finishers Society, Orlando, Florida.
48. Jendrzynsk H. (3 March), 'Chemical plating and bath process. US Patent 1959, 2(876):116.
49. Gulla M., Dutkewych O.B. (6 March), 'Electroless nickel solution. US Patent 1973, 3(719):508.
50. Souza J.F. (1 January), 'Electroless nickel plating. US Patent 1974, 3(782):978.
51. Taberner D.R. The electroless deposition of cobalt from aqueous solutions 1980, PhD Thesis, University of Portsmouth, Portsmouth.
52. Gutzeit G. An outline of the chemistry involved in the process of catalytic nickel deposition from aqueous solution. Plating 1960, 1:63-70.
53. Feldstein N., Lancsek T.S. A new technique for investigating the electrochemical behaviour of electroless plating baths and the mechanism of electroless nickel plating. Trans. Inst. Metal Finishing 1971, 49:156-161.
54. Parker K. The formulation of electroless nickel baths. Proceedings of the AES Annual Technical Conference, 16-19 July 1984 1984, American Electroplaters Society, East Orange, New Jersey, Paper B-2.
55. Sotskaya N.V., Ryabinina E.I., Kravchenko T.A., Shikhaliev Kh.S. The role of organic additives in the electroless nickel plating bath. Protection Metals 2003, 39(3):245-249.
56. Brown H. Effects of unsaturated compounds in nickel and cobalt plating. Trans. Inst. Metal Finishing 1969, 47:63-69.
57. Tulsi S.S. Properties of electroless nickel. Trans. Inst. Metal Finishing 1986, 64:73-76.
58. 3-TiC-Co ceramic. Composites Appl. Sci. Mf 2005, 36(5):715-718.
59. 3-Ni composites prepared by electroless deposition. Surf. Coat. Technol 2005, 192(1):39-42.
60. Kuiry S.C., Wannaparhun S., Narendra Dahotre B., Seal S. In-situ formation of Ni-alumina nanocomposite during laser processing. Scr. Mater 2004, 50(9):1237-1240.
61. Jiang G., Gilbert M., Hitt D.J., Wilcox G.D., Balasubramanian K. Preparation of nickel coated mica as a conductive filler. Composites Appl. Sci. Mf 2004, 33(5):745-751.
62. Ramaseshan R., Seshadri S.K., Nair N.G. Electroless nickelphosphorus coating on Ti and Al elemental powders. Scripta. Mater 2001, 45(2):183-189.
63. Charbonnier M., Goepfert Y., Romand M., Leonard D. Electroless plating of glass and silicon substrates through surface pretreatments involving plasma - polymerization and grafting processes. J. Adhes 2004, 80(12):1103-1130.
64. Brandow S.L., Dressick W.J., Marrian C.R.K., Chow G.M., Calvert J.M. The morphology of electroless Ni deposition on a colloidal Pd(II) catalyst. J. Electrochem. Soc 1995, 142(7):1103-1130.
65. Charbonnier M., Alami M., Romand M.J. Plasma treatment process for palladium chemisorption onto polymers before electroless deposition. J. Electrochem. Soc 1996, 143(2):472-480.
66. Webb E., Witt C., Andryuschenko T., Reid J. Integration of thin electroless copper films in copper interconnect metallization. J. Appl. Electrochem 2004, 34(3):291-300.
67. Paunovic M., Vitkavage D. Determination of electroless copper deposition rate from polarization data in the vicinity of the mixed potential. J. Electrochem. Soc 1979, 126(12):2282.
68. Pater E.M., Bruckenstein S. Determining the thermodynamic electrode potential in the presence of a mixed potential using EQCM technique. Electrochem. Commun 2003, 5(11):958-961.
69. El-Raghy S.M., Abo-Salama A.A. The electrochemistry of electroless deposition of copper. J. Electrochem. Soc 1979, 126(2):171-176.
70. Court S. Characterization of electroless nickel coatings on aluminium and steel substrates 2002, PhD Thesis, University of Portsmouth, Portsmouth.
71. Honma H., Kobayashi T. Electroless copper deposition process using glyoxylic acid as a reducing agent. J. Electrochem. Soc 1994, 141:730.
72. Baudrand D.W. ASM Handbook, Vol. 5 1994, 290-310. ASM International, Materials Park, Ohio, 'Electroless nickel plating' Surface Engineering.
73. Kerr C., Barker D., Walsh F.C. Studies of porosity in electroless nickel deposits on ferrous substrates. Trans. Inst. Metal Finishing 1996, 74(6):214-220.
74. Kerr C. Porosity of electroless nickel coatings on mild steel substrates 1997, PhD Thesis, University of Portsmouth, Portsmouth.
75. Reade G.W., Kerr C., Barker D.B., Walsh F.C. The importance of substrate surface condition in controlling the porosity of electroless nickel deposits. Trans. Inst. Metal Finishing 1998, 76(4):149-155.
76. Nahlé A.H., Kerr C., Barker B.D., Walsh F.C. A rapid electrochemical test for porosity in electroless nickel deposits. Trans. Inst. Metal Finishing 1998, 76(1):29-34.
77. Fan C., Celis J.P., Roos J.R. Effect of substrate pretreatment on the porosity in thin nickel electrodeposits. Surf. Coat. Techol 1992, 50(3):289-294.
78. Balaraju J.N., Sankara Narayanan T.S.N., Seshadri S.K. Electroless Ni-P composite coatings. J. Appl. Electrochem 2003, 33(9):807-816.
79. Zhao Q., Liu Y. Comparisons of corrosion rates of Ni-P based composite coatings in HCl and NaCl colutions. Corros. Sci 2004, 47(11):2807-2815.
80. Zhao Q., Liu Y., Muller-Steinhagen H., Liu G. Graded Ni-P-PTFE coatings and their potential applications. Surf. Coat. Technol 2002, 155(2-3):279-284.
81. Garcia-Alonso M.C., Escudero M.L., Lopez V., Macias A. The corrosion behaviour of laser treated Ni-P alloy coatings on mild steel. Corros. Sci 1996, 38(3):515-530.
82. O'sullivan E.J., Schrott A.G., Paunovic M., Sambucetti C.J., Marino J.R., Bailey P.J., Kaja S., Semkow K.W. Electrolessly deposited diffusion barriers for microelectronics. IBM J. Res. Dev 1998, 42(5):607-620.
83. NIKLAD 795, (accessed 20 June 2005). http://www.galladechem.com/catalog/macdermid/niklad-795.htm.
84. Staia M.H., Castillo E.J., Puchi E.S., Lewis B., Hintermann H.E. Wear performance and mechanism of electroless Ni-P coating. Surf. Coat. Technol 1996, 86-87(2):598-602.
85. 3 electroless composite coatings. Surf. Engng 2005, 21(1):60-66.
86. Kerr C., Barker D., Walsh F. The effects of bath ageing on the internal stress within electroless nickel deposits and other factors influenced by the ageing process. Advances in Surface Engineering 2002, Vol. II:297. Process Technology.
87. Wang Y., Tung S.C. Scuffing and wear behaviour of aluminium piston skirt coatings against aluminium cylinder bore. Wear 1999, 225-229(2):1100-1108.
88. Subramanian C., Cavallaro G., Winkelman G. Wear maps for titanium nitride coatings deposited on copper and brass with electroless nickel interlayers. Wear 2000, 241(2):228-233.