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Journal of Applied Physics

Volumn 108, Issue 10, 2010, Pages

The effect of reduction atmospheres on the sintering behaviors of inkjet-printed Cu interconnectors

(2) Kim, Inyoung a Kim, Jongryoul b

a Korea Institute of Machine and Materials (South Korea)

b Hanyang University (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE GRAIN SIZE; CAPPING MOLECULES; CU NANOPOWDERS; CU OXIDE; GASEOUS MIXTURE; INTERCONNECTORS; LOW-TEMPERATURE SINTERING; MICRO-STRUCTURAL; REDUCTION ATMOSPHERES; SINTERING BEHAVIORS; SINTERING TEMPERATURES;

FORMIC ACID; LANTHANUM COMPOUNDS;

SINTERING;

EID: 78650271867 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3511688 Document Type: Conference Paper

Times cited : (55)

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