Direct micro fabrication of flexible copper clad laminate using 355 nm UV laser

Japanese Journal of Applied Physics

Volumn 47, Issue 8 PART 3, 2008, Pages 6883-6886

  Kim, Ji Hyun ^a   Shin, Bo Sung ^a   Ko, Jong Soo ^a   Go, Jeung Sang ^a   Klm, Kwang Ryul ^a   Jeong, Young Keun ^a  

^a Pusan National University   (South Korea)

Author keywords

355 nm UV laser; Adhesive force; Copper formate; Direct Cu metallization; Polyimide; Surface modification

Indexed keywords

ARCHITECTURAL DESIGN; BOND STRENGTH (CHEMICAL); CHEMICAL BONDS; CHEMICAL MODIFICATION; CHEMICAL REACTIONS; GRAFTING (CHEMICAL); LAMINATES; LASERS; OXYGEN; PHOTOCHEMICAL REACTIONS; POLYIMIDES; POLYMERS; SYNTHESIS (CHEMICAL);

355 NM UV LASER; ADHESIVE FORCE; COPPER FORMATE; DIRECT CU METALLIZATION; SURFACE MODIFICATION;

COPPER;

EID: 55149088846     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.47.6883     Document Type: Article

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