Effects of Ar plasma and Ar fast atom bombardment (FAB) treatments on Cu/polymer hybrid surface for wafer bonding

2014 International Conference on Electronics Packaging, ICEP 2014

Volumn , Issue , 2014, Pages 78-81

  He, Ran ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

3D packaging; Cu polymer hybrid bonding; Surface activated bonding (SAB); Wafer bonding

Indexed keywords

ELECTRONICS PACKAGING; METAL CLADDING; PLASMAS; POLYMERS; SURFACE TREATMENT; WAFER BONDING; X RAY PHOTOELECTRON SPECTROSCOPY;

3D PACKAGING; FAST ATOM BOMBARDMENT; HYBRID BONDING; HYBRID SURFACE; POLYMER ADHESIVES; POLYMER SURFACES; SURFACE ACTIVATED BONDING; SURFACE-ACTIVATED BONDING METHODS;

ARGON;

EID: 84903718775     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEP.2014.6826665     Document Type: Conference Paper

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