Silicon heterojunction solar cells with copper-plated grid electrodes: Status and comparison with silver thick-film techniques

IEEE Journal of Photovoltaics

Volumn 4, Issue 4, 2014, Pages 1055-1062

  Geissbuhler, Jonas ^a   De Wolf, Stefaan ^a   Faes, Antonin ^b   Badel, Nicolas ^b   Jeangros, Quentin ^a   Tomasi, Andrea ^a   Barraud, Loris ^b   Descoeudres, Antoine ^b   Despeisse, Matthieu ^b   Ballif, Christophe ^a,b  

^a EPFL   (Switzerland)

^b CSEM   (Switzerland)

Author keywords

Copper electroplating; heterojunction; metallization; silicon; solar cell

Indexed keywords

ELECTRIC RESISTANCE; ELECTROPLATING; HETEROJUNCTIONS; METALLIZING; SILICON; SILVER; SOLAR CELLS;

CHARGE-CARRIER TRANSPORT; COPPER ELECTROPLATING; GRID ELECTRODES; MAXIMUM POWER POINT; SERIES RESISTANCES; SILICON HETEROJUNCTIONS; THICK FILM TECHNIQUE; TRANSPARENT CONDUCTIVE OXIDES;

COPPER;

EID: 84903518966     PISSN: 21563381     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPHOTOV.2014.2321663     Document Type: Article

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