Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streaming

Advances in Manufacturing

Volumn 1, Issue 3, 2013, Pages 211-217

  Strusevich, Nadezhda ^a   Desmulliez, Marc P Y ^b   Abraham, Eitan ^b   Flynn, David ^b   Jones, Thomas ^b   Patel, Mayur ^a   Bailey, Christopher ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

Author keywords

Acoustic streaming; Electronics manufacturing; Electroplating; High aspect ratio microvia; Megasonic agitation; Numerical modelling

Indexed keywords

EID: 84899842818     PISSN: 20953127     EISSN: 21953597     Source Type: Journal    
DOI: 10.1007/s40436-013-0039-9     Document Type: Article

References (14)

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