Numerical modeling of the electroplating process for microvia fabrication

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013

Volumn , Issue , 2013, Pages

  Strusevich, Nadia ^a   Bailey, Chris ^a   Costello, Suzanne ^b   Patel, Mayur ^a   Desmulliez, Marc ^b  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b HERIOT WATT UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COMSOL MULTIPHYSICS; DEPOSITED METAL; ELECTROPLATING PROCESS; MICROVIAS; SMALL FEATURES;

COMPUTATIONAL FLUID DYNAMICS; ELECTRODEPOSITION; EXPERIMENTS; MICROELECTRONICS; MICROSYSTEMS; NUMERICAL MODELS;

COMPUTER SIMULATION;

EID: 84880989238     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EuroSimE.2013.6529989     Document Type: Conference Paper

References (9)

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9. Strusevich, N. et al, "Parametric Modeling Study of Basic Electrodeposition in Microvias,", Proc. EMAP 2012, Hong Kong, December 2012, pp. 145-149.