Fabricating HARMS by using megasonic assisted electroforming

Microsystem Technologies

Volumn 14, Issue 9-11, 2008, Pages 1223-1226

  Liu, Gang ^a   Huang, Xinlong ^a   Xiong, Ying ^a   Tian, Yangchao ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTROCHEMISTRY; ELECTROFORMING; ELECTROMECHANICAL DEVICES; ELECTROMETALLURGY; ELECTROPLATING; FABRICATION; FORMING; MASS TRANSFER; MEMS; METALLIZING; METALS; MICROELECTROMECHANICAL DEVICES; MICROSTRUCTURE; OPTICAL DESIGN; PRESSURE DROP;

FABRICATION METHODS; HIGH-ASPECT-RATIO MICROSTRUCTURES; MAIN EFFECTS; MASS TRANSPORT; MEGASONIC; MEGASONIC AGITATION; METAL MICROSTRUCTURES; MICRO-ELECTRO MECHANICAL SYSTEMS; RESIST STRUCTURES; ULTRASONIC AGITATION; VOID FORMATIONS;

PHOTORESISTS;

EID: 49949087744     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0556-1     Document Type: Conference Paper

References (8)

1. Chen KS, Evans GH (2004) Two-dimensional modeling of nickel electrodeposition in LIGA microfabrication. Microsyst Technol 10(6/7):444-450
2. Deymier PA, Vasseur JO, Khelif A et al (2001) Second-order sound field during megasonic cleaning of patterned silicon wafers: application to ridges and trenches. J Appl Phys 90(8):4211-4218
3. Griffiths SK, Nilson RH, Bradshaw RW et al (1998) Transport limitations in electrodeposition for LIGA microdevice fabrication. Proc SPIE 3511:364-375
4. Hyde ME, Compton RG (2002) How ultrasound influences the electrodeposition of metals. J Electroanal Chem 531:19-24
5. Kupka RK, Bouamrane F, Cremers C et al (2000) Microfabrication: LIGA-X and applications. Appl Surf Sci 164:97-110
6. Kuttruff H (1991) Ultrasonics, fundamentals and applications. Elsevier, New York
7. Nilson RH, Griffiths SK (2002) Enhanced transport by acoustic streaming in deep trench-like cavities. J Electrochem Soc 149(4):G286-G296
8. Zanghellini J, Achenback S, El-Kholi A et al (1998) New development strategies for high aspect ratio microstructures. Microsyst Technol 4:94-97