Experimental study on the mechanical reliability of carbon nanotubes

Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013

Volumn , Issue , 2013, Pages 105-108

  Zhang, Yan ^a   Wang, Ling ^a   Fan, Jing Yu ^a   Liu, Johan ^a,b  

^a SHANGHAI UNIVERSITY   (China)

^b CHALMERS UNIVERSITY OF TECHNOLOGY   (Sweden)

Author keywords

carbon nanotube; reliability; strength

Indexed keywords

ELECTRONIC PROPERTIES; ELECTRONICS PACKAGING; INTEGRATED CIRCUITS; RELIABILITY;

CARBON NANOTUBE BUNDLE; DIFFERENT PRESSURES; ELECTRONIC COMPONENT; HIGH-POWER INTEGRATED CIRCUITS; LOADING CONDITION; MECHANICAL RELIABILITY; STRENGTH; SUPERIOR FEATURE;

CARBON NANOTUBES;

EID: 84898048296     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2013.6756433     Document Type: Conference Paper

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