Sac 305 solder paste with silver nanopowder and carbon nanotubes addition - Basic properties of pastes and solder joints

Proceedings of the International Spring Seminar on Electronics Technology

Volumn , Issue , 2012, Pages 363-366

  Kościelski, Marek ^a   Bukat, Krystyna ^a   Sitek, Janusz ^a   Jakubowska, Małgorzata ^b   Niedźwiedź, Wojciech ^b   Młozniak, Anna ^c  

^a TELE AND RADIO RESEARCH INSTITUTE   (Poland)

^b WARSAW UNIVERSITY OF TECHNOLOGY   (Poland)

^c ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

BASIC PROPERTIES; GRAIN SIZE; SHEAR TESTS; SILVER NANOPOWDER; SOLDER BALLS; SOLDER JOINTS; SOLDER PASTE;

CARBON NANOTUBES; NANOSTRUCTURED MATERIALS; POWER ELECTRONICS; SOLDERING;

SILVER;

EID: 84867049990     PISSN: 21612528     EISSN: 21612536     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2012.6273162     Document Type: Conference Paper

References (8)

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8. Krystyna Bukat, Marek Kościelski, Janusz Sitek, Małgorzata Jakubowska, Anna Młożniak, (2011), "Silver nanoparticles effect on the wettability of Sn-Ag-Cu solder pastes and solder joints microstructure on copper", Soldering and Surface Mount Technology, Vol. 23 No 3, 2011, pp.150-160.