Fluidic aligned, dense SWNTs arrays as potential die adhesive and thermal interface material

Soldering and Surface Mount Technology

Volumn 25, Issue 1, 2013, Pages 45-50

  Rong, Hao ^a   Wang, Baoming ^a   Lin, Wei Qing ^a   Sun, Lichao ^a   Zheng, Jin Cheng ^a   Lu, Miao ^a  

^a XIAMEN UNIVERSITY   (China)

Author keywords

Adhesives; Fluidic aligned single walled carbon nanotubes; Microprocessor chips; Shear strength; Thermal interface materials

Indexed keywords

ALIGNED SINGLE-WALLED CARBON NANOTUBES; CAPILLARY FORCE; DESIGN/METHODOLOGY/APPROACH; DIE ADHESIVES; FACE TO FACE; LASER FLASH METHODS; MECHANICAL AND THERMAL PROPERTIES; POTENTIAL CAPABILITY; ROOM TEMPERATURE; SILICON CHIP; THERMAL CONDUCTANCE; THERMAL INTERFACE MATERIALS; VERTICALLY ALIGNED;

ADHESIVES; ELECTRONIC EQUIPMENT; INTERFACES (MATERIALS); MICROPROCESSOR CHIPS; SHEAR STRENGTH; SINGLE-WALLED CARBON NANOTUBES (SWCN); STRENGTH OF MATERIALS; THERMAL INSULATING MATERIALS;

THERMAL CONDUCTIVITY;

EID: 84874351232     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911311294614     Document Type: Article

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