High-density feedthrough technology for hermetic biomedical micropackaging

Materials Research Society Symposium Proceedings

Volumn 1572, Issue , 2013, Pages 33-38

  Gill, Emma C ^a   Antalek, John ^a   Kimock, Fred M ^b   Nasiatka, Patrick J ^c   McIntosh, Ben P ^c   Tanguay Jr , Armand R ^c   Weiland, James D ^d  

^a Morgan Advanced Materials Alberox   (United States)

^b Four Circle Incorporated   (United States)

^c Department of Electrical Engineering Electrophysics University of Southern California University Park MC 0483 ^*  (United States)

^d UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; BIOCOMPATIBILITY; CERAMIC MATERIALS; HELIUM; INTERFACES (MATERIALS); IONIC CONDUCTION; PLATINUM; SEALING (FINISHING);

BIOMEDICAL DEVICES; CATASTROPHIC FAILURES; ELECTRICAL CONTACTS; FABRICATION PROCESS; HUMAN NERVOUS SYSTEM; MINIATURIZED PACKAGING; MULTI-LAYERED COMPOSITES; SEALING TECHNOLOGY;

TECHNOLOGY;

EID: 84897699021     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/opl.2013.735     Document Type: Conference Paper

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