Integrated wireless neural interface based on the Utah electrode array

Biomedical Microdevices

Volumn 11, Issue 2, 2009, Pages 453-466

  Kim, S ^a   Bhandari, R ^a   Klein, M ^b   Negi, S ^a   Rieth, L ^a   Tathireddy, P ^a   Toepper, M ^b   Oppermann, H ^b   Solzbacher, F ^a  

^a Department of Electrical and Computer Engineering   (United States)

^b FRAUNHOFER IZM   (Germany)

Author keywords

Flip chip bonding; Hybrid integration; Neural interface; Neural microelectrode; Under bump metallization (UBM); Utah electrode array (UEA)

Indexed keywords

FLIP CHIP BONDING; HYBRID INTEGRATION; NEURAL INTERFACE; NEURAL MICROELECTRODE; UNDER BUMP METALLIZATION (UBM); UTAH ELECTRODE ARRAY (UEA);

BIOLOGICAL MATERIALS; BONDING; BRAZING; CAPACITANCE; CAPACITORS; INDUSTRIAL RESEARCH; MECHANICAL PROPERTIES; MECHANICAL STABILITY; METALLIZING; MICROELECTRODES; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; POLYIMIDES; POLYMERS; SEMICONDUCTING SILICON COMPOUNDS; SIGNAL PROCESSING; SILICON CARBIDE; SOLDERING ALLOYS; SUBSTRATES; SURFACE DEFECTS; WELDING;

FLIP CHIP DEVICES;

COPPER; GOLD; PLATINUM; TIN; TITANIUM;

AMPLIFIER; ARTICLE; BIOCOMPATIBILITY; DEVICE; ENCAPSULATION; MATERIAL COATING; MICROELECTRODE; PRIORITY JOURNAL; RADIOFREQUENCY; SHEAR STRENGTH;

ELECTRODES, IMPLANTED; ELECTROPHYSIOLOGY; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; MICROELECTRODES; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY; SIGNAL PROCESSING, COMPUTER-ASSISTED; SYSTEMS INTEGRATION; TELEMETRY;

EID: 62649137024     PISSN: 13872176     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10544-008-9251-y     Document Type: Article

References (47)

1. J. Aziz, R. Genov, M. Derchansky, B. Bardakjian, P. Carlen, 256-Channel Neural Recording Microsystem with On-Chip 3D Electrodes. In Proceedings of 2007 IEEE International Solid-State Circuits Conference, 160-161, 594, San Francisco, CA, USA (2007)
2. A. Branner, R.B. Stein, E. Fernandez, Y. Aoyagi, R.A. Normann, Long-term stimulation and recording with a penetrating microelectrode array in cat sciatic nerve IEEE Trans. Biomed. Eng. 51, 146-157 (2004). doi: 10.1109/ TBME.2003.820321
3. P.K. Campbell, K.E. Jones, R.J. Huber, K.W. Horch, R.A. Normann, A silicon-based, three-dimensional neural interface: Manufacturing processes for an intra cortical electrode array IEEE Trans. Biomed. Eng 38, 758-768 (1991). doi: 10.1109/10.83588
4. C.A. Chestek, V. Gilja, R.J. Kier, P. Nuyujukian, S.I. Ryu, F. Solzbacher, R. Harrison, K.V. Shenoy, C. Hermes, RF wireless low-power neural recording system for freely-behaving primates. In Proc. of the 2008 IEEE International Symposium on Circuits and Systems (ISCAS 2008), Seattle, Washington (2008)
5. G.A. DeMichele, P.R. Troyk, Integrated multichannel wireless biotelemetry system. In Proc. 25th Int. IEEE-EMBS Conf., 3372-3375, Cancun, Mexico (2003)
6. S. Farshchi, P. Nuyujukian, A. Pesterev, I. Mody, J.W. Judy, A. Tiny, OS enabled MICA2-based wireless neural interface IEEE Trans. Biomed. Eng. 53, 1416-1424 (2006). doi: 10.1109/TBME.2006.873760
7. M.D. Gingerich, J.F. Hetke, D.J. Anderson, K.D. Wise, A 256-site 3-D CMOS microelectrode array for multipoint stimulation and recording in the central nervous system. In Proc. Int. Conf. Solid-State Sensors and Actuators, 416-419, Munich, Germany (2001)
8. R. Hahn, A. Kamp, A. Ginolas, M. Schmidt, J. Wolf, V. Glaw, M. Töpper, O. Ehrmann, H. Reichl, High power multichip modules employing the planar embedding technique and microchannel water heat sinks IEEE Trans. Compon. Pack. A 20, 432-441 (1997)
9. R.R. Harrison, P.T. Watkins, R.J. Kier, R.O. Lovejoy, D.J. Black, B. Greger, F. Solzbacher, A low-power integrated circuit for a wireless100-electrode neural recording system IEEE J. Solid-State Circuits 42, 123-133 (2007a). doi: 10.1109/JSSC.2006.886567
10. R.R. Harrison, P.T. Watkins, R.J. Kier, D.J. Black, R.O. Lovejoy, R.A. Normann, F. Solzbacher, Design and testing of an integrated circuit for multi-electrode neural recording. In Proceedings of the 20th International Conference on VLSI Design (VLSID 2007), Bangalore, India (2007b)
11. R.R. Harrison, R.J. Kier, C.A. Chestek, V. Gilja, P. Nuyujukian, S.I. Ryu, B. Greger, F. Solzbacher, K.V. Shenoy, Wireless neural signal acquisition with single low-power integrated circuit. In Proc. of the 2008 IEEE International Symposium on Circuits and Systems (ISCAS 2008), Seattle, Washington (2008)
12. J.L. Hill, D.E. Culler, Mica: A wireless platform for deeply embedded networks IEEE Micro 22, 12-24 (2002). doi: 10.1109/MM.2002.1134340
13. L.R. Hochberg, M.D. Serruya, G.M. Friehs, J.A. Mukand, M. Saleh, A.H. Caplan, A. Branner, D. Chen, R.D. Penn, J.P. Donoghue, Neuronal ensemble control of prosthetic devices by a human with tetraplegia Nature 442, 164-171 (2006). doi: 10.1038/nature04970
14. A.C. Hoogerwerf, K.D. Wise, A three-dimensional microelectrode array for chronic neural recording IEEE Trans. Biomed. Eng. 41, 1136-1146 (1994). doi: 10.1109/10.335862
15. J.-M. Hsu, L. Rieth, S. Kammer, K.P. Koch, R.A. Normann, F. Solzbacher, PECVD a-SiC:H and Parylene encapsulation for chronically implanted neural recording devices. NIH/NINDS Neural Interfaces Workshop, Bethesda, MD, USA (2005)
16. J.-M. Hsu, P. Tathireddy, L. Rieth, R.A. Normann, F. Solzbacher, Characterization of a-SiCx:H thin films as an encapsulation material for integrated silicon based neural interface devices Thin. Solid. Films 516, 34-41 (2007). doi: 10.1016/j.tsf.2007.04.050
17. J.-M. Hsu, L. Rieth, R.A. Normann, P. Tathireddy, F. Solzbacher, Hermetic encapsulation of an integrated neural interface device with Parylene-C. IEEE Trans. Biomed. Eng. (2008a) accepted for publication
18. J.-M. Hsu, L. Rieth, S. Kammer, M. Orthner, F. Solzbacher, Influence of thermal and deposition processes on the surface morphology, crystallinity, and adhesion of Parylene-C Sens. Mater. 20, 071-086 (2008b)
19. M. Hutter, H. Hohnke, H. Oppermann, M. Klein, G. Engelmann, Assembly and Reliability of Flip Chip Solder Joints Using Miniaturized Au/Sn Bumps., In Proc. 54th Electronic Components and Technology Conf., Las Vegas, NV, USA (2004)
20. P. Irazoqui-Pastor, I. Mody, J.W. Judy, Transcutaneous RF-powered neural recording device. In Proc. 24th Annu. Conf./Annu. Fall Meeting Biomedical Engineering Society 3, 2105-2106, Houston, TX, USA (2002)
21. K.E. Jones, P.K. Campbell, R.A. Normann, A glass/silicon composite intra cortical electrode array Ann. Biomed. Eng. 20, 423-437 (1992). doi: 10.1007/BF02368134
22. C. Kim, K.D. Wise, A 64-site multishank CMOS low-profile neural stimulating probe IEEE J. Solid-State Circuits 31, 1230-1238 (1996). doi: 10.1109/4.535406
23. S. Kim, K. Zoschke, M. Klein, D. Black, K. Buschick, M. Toepper, P. Tathireddy, R. Harrison, H. Oppermann, F. Solzbacher, Switchable polymer based thin film coils as a power module for wireless neural interfaces Sensors Actuators A 136, 467-474 (2007). doi: 10.1016/j.sna.2006.10.048
24. D.R. Kipke, R.J. Vetter, J.C. Williams, J.F. Hetke, Silicon-substrate intracortical microelectrode arrays for long-term recording of neuronal spike activity in cerebral cortex IEEE Trans. Neural Syst. Rehabil. Eng. 11, 151-155 (2003). doi: 10.1109/TNSRE.2003.814443
25. S. Martel, N. Hatsapoulos, I. Hunter, J. Donoghue, J. Burger, J. Malasek, C. Wiseman, R. Dyer, Development of a Wireless Brain Implant: the Telemetric Electrode Array System (TEAS) Project. In Proceedings of the 23rd Annual EMBS International Conference, Istanbul, Turkey (2001)
26. M. Modarreszadeh, R.N. Schmidt, Wireless, 32-channel, EEG and epilepsy monitoring system. In Proc. 19th Int. Conf. IEEE/EMBS, 1157-1160, Chicago, IL, USA (1997)
27. P. Mohseni, K. Najafi, A wireless FM multichannel microsystem for biomedical neural recording applications. In Proc. IEEE Southwest Symp. Mixed Signal Design, 217-222, Tucson, AZ, USA (2003)
28. P. Mohseni, K. Najafi, Wireless multichannel biopotential recording using an integrated FM telemetry circuit. In Proc. 26th Annu. Int. Conf. Engineering in Medicine and Biology Soc., 4083-4086, San Francisco, CA, USA (2004)
29. A. Nieder, Miniature stereo radio transmitter for simultaneous recording of multiple single-neuron signals from behaving owls J. Neurosci. Methods 101, 157-164 (2000). doi: 10.1016/S0165-0270(00)00263-6
30. I. Obeid, M.A.L. Nicolelis, P.D. Wolf, A multichannel telemetry system for single unit neural recordings J. Neurosci. Methods 133, 33-38 (2004). doi: 10.1016/j.jneumeth.2003.09.023
31. J. Parramon, P. Doguet, D. Martin, M. Verleyssen, R. Munoz, L. Leija, E. Valderrama, ASIC-based batteryless implantable telemetry microsystem for recording purposes. In Proc. 19th Int. IEEE-EMBS Conf., 2225-2228, Chicago, IL, USA (1997)
32. W.R. Patterson, Y.-K. Song, C.W. Bull, I. Ozden, A.P. Deangellis, C. Lay, J.L. McKay, A.V. Nurmikko, J.D. Donoghue, B.W. Connors, A microelectrode/microelectronic hybrid device for brain implantable neuroprosthesis applications IEEE Trans. Biomed. Eng. 51, 1845-1853 (2004). doi: 10.1109/TBME.2004.831521
33. P.J. Rousche, R.A. Normann, Chronic recording capability of the Utah Intracortical Electrode Array in cat sensory cortex J. Neurosci. Methods 82, 1-15 (1998). doi: 10.1016/S0165-0270(98)00031-4
34. P.J. Rousche, R.A. Normann, Chronic intracortical microstimulation (ICMS) of cat sensory cortex using the utah intracortical electrode array IEEE Trans. Rehabil. Eng. 7, 56-68 (1999). doi: 10.1109/86.750552
35. G. Santhanam, S.I. Ryu, B.M. Yu, A. Afshar, K.V. Shenoy, A high-performance brain-computer interface Nature 442, 195-198 (2006). doi: 10.1038/nature04968
36. H.J. Song, D.R. Allee, K.T. Speed, Single chip system for bio-data acquisition, digitization and telemetry In Proc. 1997 IEEE Int. Symp. Circuits Systems 3, 1848-1851 (1997)Hong Kong
37. Y.-K. Song, W.R. Patterson, C.W. Bull, D.A. Borton, Y. Li, A.V. Nurmikko, J.D. Simeral, J.D. Donoghue, A brain implantable microsystem with hybrid RF/IR telemetry for advanced neuroengineering applications. In Proceedings of the 29th Annual International Conference of the IEEE EMBS, 445-448, Lyon, France (2007)
38. T. Stieglitz, H. Beutel, M. Schuettler, J.-U. Meyer, Micromachined, polyimide-based devices for flexible neural interfaces Biomed. Microdevices 2, 283-294 (2000). doi: 10.1023/A:1009955222114
39. T. Stieglitz, M. Schuettler, K.P. Koch, Implantable biomedical microsystems for neural prostheses IEEE Eng. Med. Biol. Mag. 24, 58-65 (2005). doi: 10.1109/MEMB.2005.1511501
40. S. Takeuchi, I. Shimoyama, A radio-telemetry system with a shape memory alloy microelectrode for neural recording of freely moving insects IEEE Trans. Biomed. Eng. 51, 133-137 (2004). doi: 10.1109/TBME.2003.820310
41. M.E. Thomas, M.P. Hartnett, J.E. McKay, The use of surface profilometers for the measurement of wafer curvature J. Vac. Sci. Technol. A 6, 2570-2571 (1998). doi: 10.1116/1.575550
42. M. Töpper, J. Wolf, V. Glaw, K. Buschick, A. Dabek, L. Dietrich, O. Ehrmann, H. Reichl, MCM-D with Embedded Active and Passive Components. In Proceedings ISHM 1996, Minneapolis, USA (1996)
43. M. Töpper, K. Buschick, J. Wolf, V. Glaw, R. Hahn, A. Dabek, O. Ehrmann, H. Reichl, Embedding Technology - A Chip-First Approach using BCB. In Proc. of the 3rd International Symposium on Advanced Packaging Materials, 11-14 (1997)
44. M. Töpper, D. Tönnies, Microelectronic Packaging, in Semiconductor Fabrication Handbook, ed. by M.H. Geng (McGraw-Hill, 2005), pp. 21.1-21.54
45. K.D. Wise, D.J. Anderson, J.F. Hetke, D.R. Kipke, K. Najafi, Wireless implantable microsystems: High-density electronic interfaces to the nervous system Proc. IEEE 92, 76-97 (2004). doi: 10.1109/ JPROC.2003.820544
46. Y. Yao, M.N. Gulari, J.F. Hetke, K.D. Wise, A self-testing multiplexed CMOS stimulating probe for a 1024-site neural prosthesis. In Proc. IEEE Int. Conf. Solid-State Sensors and Actuators, 1213-1216, Boston, MA, USA (2003)
47. Y. Yao, M.N. Gulari, J.A. Wiler, K.D. Wise, A microassembled low-profile three-dimensional microelectrode array for neural prosthesis applications J. Microelectromech. Syst. 16, 977-988 (2007). doi: 10.1109/ JMEMS.2007.896712