Tension-induced softening and hardening in gradient nanograined surface layer in copper

Scripta Materialia

Volumn 77, Issue , 2014, Pages 17-20

  Fang, T H ^a   Tao, N R ^a   Lu, K ^a,b  

^a INSTITUTE OF METAL RESEARCH   (China)

^b NANJING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Copper; Gradient nanograined (GNG) structure; Grain growth; Grain refinement; Hardness test

Indexed keywords

COARSE-GRAINED; CRITICAL SIZE; GRAIN SIZE; MICROHARDNESS MEASUREMENT; MICROMETER SCALE; SEVERE PLASTIC DEFORMATIONS; SURFACE LAYERS; SURFACE MECHANICAL GRINDING TREATMENTS;

GRAIN GROWTH; GRAIN REFINEMENT; GRAIN SIZE AND SHAPE; HARDENING; HARDNESS TESTING;

COPPER;

EID: 84896734280     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2014.01.006     Document Type: Article

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