Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature

Journal of Materials Science and Technology

Volumn 27, Issue 8, 2011, Pages 673-679

  Yan, F ^a   Zhang, H W ^a   Tao, N R ^a   Lu, K ^a  

^a INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Convergent beam electron diffraction; Cu; Dynamic plastic deformation; Quantitative structural characterization; Transmission electron microscopy

Indexed keywords

CONVERGENT-BEAM ELECTRON DIFFRACTION; CRYOGENIC TEMPERATURES; DEFORMATION TWIN; DISLOCATION SLIP; DYNAMIC PLASTIC DEFORMATION; LOW ANGLE BOUNDARIES; LOW STRAIN RATES; NANO-METER SCALE; SHEAR BANDING; STRUCTURAL CHARACTERISTICS; STRUCTURAL CHARACTERIZATION; TRANSMISSION ELECTRON;

CRYOGENICS; ELECTRON DIFFRACTION; ELECTRONS; MICROSTRUCTURE; PLASTIC DEFORMATION; STRAIN RATE; TRANSMISSION ELECTRON MICROSCOPY;

TWINNING;

EID: 80052392965     PISSN: 10050302     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1005-0302(11)60124-2     Document Type: Article

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