Room-temperature bonding technique based on copper nanowire surface fastener

Applied Physics Express

Volumn 6, Issue 3, 2013, Pages

  Wang, Peng ^a   Ju, Yang ^a   Chen, Mingji ^a   Hosoi, Atsushi ^a   Song, Yuanhui ^a   Iwasaki, Yuka ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING TECHNIQUES; COPPER NANOWIRES; MECHANICAL AND ELECTRICAL PROPERTIES; NANOWIRE ARRAYS; ROOM TEMPERATURE; SILICON SUBSTRATES; TEMPLATE-ASSISTED ELECTRODEPOSITIONS;

BONDING; COPPER; ELECTRIC PROPERTIES; VAN DER WAALS FORCES;

NANOWIRES;

EID: 84875498179     PISSN: 18820778     EISSN: 18820786     Source Type: Journal    
DOI: 10.7567/APEX.6.035001     Document Type: Article

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