Determination of component candidacy for second side reflow with lead-free solder

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 970-976

  Liu, Yueli ^a,b   Geiger, David A ^a   Shangguan, Dongkai ^a  

^a FLEXTRONICS INTERNATIONAL   (United States)

^b AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPONENT WEIGHT; DESIGN OF EXPERIMENTS (DOE); SOLDER BOARDS;

SOLDERED JOINTS; SURFACE TENSION; TIN;

SOLDERING ALLOYS;

EID: 24644487387     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Philip Zarrow, "Soldering", Surface Mount Technology (SMT), August 2000.
2. Philip Zarrow, "Fear and loathing with double sided reflow soldering", Circuit Assembly, June 1997.
3. Philip Zarrow, "Reflow Soldering of Through-hole Components", SMT Express, Volume 2, Issue No.1 January 2000.
4. Joe Belmonte and Phil Zarrow, "Single Center Reflow of Through Hole Components". Circuit Assembly, September 1996.
5. http://hyperphysics.phy-astr.gsu.edu/hbase/surten.html#c1