Copper/parylene core/shell nanowire surface fastener used for room-temperature electrical bonding

Langmuir

Volumn 29, Issue 45, 2013, Pages 13909-13916

  Wang, Peng ^a   Ju, Yang ^a   Cui, Yanbin ^a   Hosoi, Atsushi ^a  

^a NAGOYA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CORE/SHELL NANOWIRES; CORE/SHELL STRUCTURE; ELECTRICAL RESISTANCES; ELECTRONIC ASSEMBLIES; ELECTRONIC COMPONENT; HIGH TEMPERATURE PROCESS; MECHANICAL AND ELECTRICAL PROPERTIES; THEORETICAL MODELING;

ADHESION; FLIP CHIP DEVICES; LOCKS (FASTENERS); NANOWIRES; SOLDERING; VAN DER WAALS FORCES;

ELECTRIC PROPERTIES;

EID: 84887580061     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la402475f     Document Type: Article

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