Correction: Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics (Nanoscale (2014) 6 (2669-2674) DOI: 10.1039/c3nr05290g);Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

Nanoscale

Volumn 6, Issue 5, 2014, Pages 2669-2674

  Subramaniam, Chandramouli ^a   Yasuda, Yuzuri ^a   Takeya, Satoshi ^b   Ata, Seisuke ^a,b   Nishizawa, Ayumi ^a   Futaba, Don ^a,b   Yamada, Takeo ^a,b   Hata, Kenji ^a,b  

^a Technology Research Association for Single Wall Carbon Nanotubes TASC   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBES; COPPER; ELECTRONIC COOLING; EXPANSION; INTERFACES (MATERIALS); SILICON; THERMAL CONDUCTIVITY; YARN;

COOLING OF ELECTRONICS; FUNCTIONAL COMPLEXITY; HIGH THERMAL CONDUCTIVITY; HIGH VOLUME FRACTION; SEAMLESS INTEGRATION; THERMAL CONTRIBUTIONS; THERMAL DISTORTION PARAMETERS; THERMAL EXPANSION COEFFICIENTS;

THERMAL EXPANSION;

EID: 84894656307     PISSN: 20403364     EISSN: 20403372     Source Type: Journal    
DOI: 10.1039/c9nr90011j     Document Type: Erratum

References (25)

1. US Congress, Office of Technology Assessment, Miniaturization Technologies, OTA-TCT-514, U.S. Government Printing Office, Washington, DC, 1991
2. S. Krishnan S. V. Garimella G. M. Chrysler R. V. Mahajan IEEE Trans. Adv. Packag. 2007 30 462
3. S. Dvira N. Abraham H. Peter J. Chem. Phys. 2003 119 6840
4. L. B. Kish Phys. Lett. A 2002 305 144
5. A. Vassighi M. Sachdev IEEE Trans. Device Mater. Reliab. 2006 6 300
6. C. J. Liu, G. Q. Zhang, L. J. Ernst, M. Vervoort and G. Wisse, Proceedings of 51st Electronic Components and Technology Conference, 2001, p. 624
7. C. Li T. W. Chou Phys. Rev. B: Condens. Matter Mater. Phys. 2005 71 235414
8. G. Cao X. Chen J. W. Kysar J. Mech. Phys. Solids 2006 54 1206
9. K. Chu Q. Wu C. Jia X. Liang J. Nie W. Tian G. Gai H. Guo Compos. Sci. Technol. 2010 70 298
10. K. T. Kim J. Eckert G. Liu J. M. Park B. K. Lim S. H. Hong Scr. Mater. 2011 64 181
11. S. R. Bakshi D. Lahiri A. Agarwal Int. Mater. Rev. 2010 55 41
12. I. R. Walker, Reliability in scientific research: improving the dependability of measurements, calculations, equipment and software, University Press, Cambridge, 2011
13. K. Hata D. N. Futaba K. Mizuno T. Namai M. Yumura S. Iijima Science 2004 306 1362
14. C. Subramaniam T. Yamada K. Kobashi A. Sekiguchi D. N. Futaba M. Yumura K. Hata Nat. Commun. 2013 4 2202
15. Y. Zoo D. Adams J. W. Mayer T. L. Alford Thin Solid Films 2006 513 170
16. D. N. Futaba K. Hata T. Yamada T. Hiraoka Y. Hayamizu Y. Kakudate O. Tanaike H. Hatori M. Yumura S. Iijima Nat. Mater. 2006 5 987
17. A. V. Mazur M. M. Gasik J. Mater. Process. Technol. 2009 209 723
18. Z. Xu M. J. Buehler ACS Nano 2009 3 2767
19. A. Agarwal, S. R. Bakshi and D. Lahiri, Carbon nanotubes reinforced metal matrix composites, CRC Press, U.S.A., 2011
20. S. D. Bergin Z. Sun D. Rickard P. V. Streich J. P. Hamilton J. N. Coleman ACS Nano 2009 3 2340
21. J. Hone M. Whitney C. Piskoti A. Zettl Phys. Rev. B: Condens. Matter Mater. Phys. 1999 59 R2514
22. S. Berber Y. K. Kwon D. Tomanek Phys. Rev. Lett. 2000 84 4613
23. C. Kittel, Introduction to Solid State Physics, John Wiley& Sons, U.S.A., 2005
24. P. S. Turner J. Res. Natl. Bur. Stand. 1946 37 239
25. K. Z. Milowska J. A. Majewski Phys. Chem. Chem. Phys. 2013 15 14303