Buckling driven interface delamination between a thin metal layer and a ceramic substrate

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 624-631

  Liu, C J ^a   Zhang, G Q ^b   Ernst, L J ^a   Vervoort, M ^b   Wisse, G ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BUCKLING; CERAMIC MATERIALS; COMPUTER SIMULATION; COPPER; DELAMINATION; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; INTERFACES (MATERIALS); RELIABILITY; SUBSTRATES; THERMAL EXPANSION; THIN FILMS;

INTERFACE DELAMINATION; MISMATCH OF THERMAL EXPANSION; THERMO-MECHANICAL LOADING; THIN COPPER LAYER;

ELECTRONICS PACKAGING;

EID: 0034833275     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2001.927794     Document Type: Article

References (10)

1. Recent analytical results on delamination buckling and growth
2. Characterization of delamination onset and growth in a composite laminate
3. Initiation of free-edge delamination in composite laminates
4. An overview of the delamination problem in structural composite
5. Subcritical matrix failures in cross-ply composite laminates with double-edge-semicircular notches
6. The dependence of transverse cracking and delamination on ply thickness in graphiet-epoxy laminates
7. Cracks on bimaterial interfaces: Elasticity and plasticity aspect
8. Mixed mode cracking in layered materials
9. Mixid mode interfacial fracture thoughness investigations for thermo-mechanical reliability enhancement of plastic packages