Flipchip bonding of thin Si dies onto PET foils: Possibilities and applications

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

Volumn , Issue , 2011, Pages

  Van Den Brand, Jeroen ^a   Kusters, Roel ^a   Cauwe, Maarten ^b   Van Den Ende, Daan ^c   Erinc, Muge ^c  

^a HOLST CENTRE   (Netherlands)

^b IMEC   (Belgium)

^c TNO   (Netherlands)

Author keywords

flip chip; large area electronics; PET; thin chip

Indexed keywords

BONDING PROCESS; FINITE ELEMENT MODELS; FLEXURAL TESTS; FLIP CHIP; FLIP CHIP BONDING; LARGE-AREA ELECTRONICS; LOW COSTS; LOW-TEMPERATURE STABILITY; MATERIAL PARAMETER; SCREEN-PRINTED; SENSOR PACKAGES; SI CHIPS; SUBSTRATE MATERIAL; THIN CHIPS; ULTRA-THIN CHIPS; WARPAGES;

MICROELECTRONICS; PACKAGING; POLYETHYLENE TEREPHTHALATES; SILICON; SUPPLY CHAINS;

CHIP SCALE PACKAGES;

EID: 84857603364     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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