Release of moving silicon microstructures embedded in a bonded multi-wafer stack using DRIE

2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Volumn , Issue , 2013, Pages 163-166

  Hergert, R J ^a   Karl, W J ^a   Holmes, A S ^a  

^a IMPERIAL COLLEGE LONDON   (United Kingdom)

Author keywords

Embedded Structures; Integrated Ball Cage; Micro Ball Bearing; Microfabrication; Micromachining; Multi Wafer Process; Nested DRIE; Release Etch; Rotary MEMS; Sacrificial Silicon Beams; Stencil Etching

Indexed keywords

EMBEDDED STRUCTURES; INTEGRATED BALL CAGE; MICRO BALLS; NESTED DRIE; RELEASE ETCH; SILICON BEAMS;

ACTUATORS; BALL BEARINGS; BIOMEDICAL EQUIPMENT; MICROFABRICATION; MICROMACHINING; MICROSTRUCTURE; MICROSYSTEMS; SILICON; SOLID-STATE SENSORS; WAFER BONDING;

SILICON WAFERS;

EID: 84891713025     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/Transducers.2013.6626727     Document Type: Conference Paper

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