A universal CMP process description language for standardization

Materials Research Society Symposium Proceedings

Volumn 867, Issue , 2005, Pages 215-220

  Yoshida, Takafumi ^a  

^a YNT jpCom   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

STANDARDIZATION; STANDARDS;

CHEMICAL MECHANICAL PLANARIZATION (CMP); PROCESS DESCRIPTION LANGUAGE;

CHEMICAL MECHANICAL POLISHING;

EID: 30544451543     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-867-w2.9     Document Type: Conference Paper

References (9)

1. ITRS, International Technology Roadmap for Semiconductors (2004)
2. J. M. Steigerwald, S. P. Murarka, R. J. Gutmann, "Chemical Mechanical Planarization of Microelectronic Materials" (1997)
3. W. W. Gibbs, "Software's Chronic Crisis," Scientific American, Sept., 86 (1994)
4. SEMI, Semiconductor Equipment and Materials International, http://www.semi.org/
5. International SEMATECH, http://www.sematech.org/
6. W3C, The World Wide Web Consortium, http://www.w3c.org/XML/
7. RosettaNET, http://www.rosettanet.org/
8. CMPxML, http://www.ynt-jp.com/siliconlab/CMPxML/
9. A. Skonnard, M. Gudgin, "Essential XML Quick Reference," Addison-Wesley (2002)