Pad asperity parameters for CMP process simulation

Materials Research Society Symposium Proceedings

Volumn 816, Issue , 2004, Pages 231-236

  Yoshida, Takafumi ^a  

^a YNT jpCom   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY ELEMENT METHOD; COMPUTER SIMULATION; DEFORMATION; ELASTIC MODULI; MATHEMATICAL MODELS; ULSI CIRCUITS; WSI CIRCUITS;

CONTACT MECHANICS; HERTZ MODEL; MATERIAL REMOVAL RATE (MRR); PAD ASPERITY PARAMETERS;

CHEMICAL MECHANICAL POLISHING;

EID: 12744280140     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-816-k8.4     Document Type: Conference Paper

References (11)

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2. T.Yoshida, ECS & JAP Joint Internl. Meeting, 593 (1999)
3. J.Luo, David Dornfeld, IEEE Trans. Semi. Manuf. Vol.14 No.2, 112 (2001)
4. A.Bastawros, Abhijit Chandra, Yongin Guo, CMPMIC, 365 (2003)
5. J.Vlassak, MRS Spring, M4.6 (2001)
6. K.L.Johnson, "Contact Mechanics", Cambridge University Press, 411 (1985)
7. T.Yoshida, MRS Spring Meeting, F1.1 (2003)
8. T.Yoshida, CMP-MIC, 151 (2003)
9. M.Oliver, R.Schmidt, M.Robinson, ECS 4th Intern' Symp. CMP, Abs# 487 (2000)
10. A.Scott Lawing, MRS Spring, 15.3 (2002)
11. T.Yoshida, CMP-MIC, 411 (2004)