Preparation of EMI shielding and corrosion-Resistant composite based on electroless Ni-Cu-P coated wood

BioResources

Volumn 8, Issue 4, 2013, Pages 6097-6110

  Hui, Bin ^a   Li, Jian ^a   Wang, Lijuan ^a  

^a NORTHEAST FORESTRY UNIVERSITY   (China)

Author keywords

Anti corrosion; Birch veneer; Electroless Ni Cu P plating; Electromagnetic shielding effectiveness

Indexed keywords

COATINGS; CORROSION; CORROSION PROTECTION; CORROSION RESISTANCE; CRYSTAL STRUCTURE; DEPOSITION; MAGNETIC SHIELDING; METAL IMPLANTS; NICKEL; NICKEL COATINGS; PH; PH EFFECTS; SCANNING ELECTRON MICROSCOPY; SHIELDING; VENEERS; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

3.5 WT% NACL SOLUTION; ANTI-CORROSION; ANTI-CORROSION PROPERTY; CHEMICAL COMPOSITIONS; CORROSION-RESISTANT COMPOSITES; ELECTROLESS NI; ELECTROMAGNETIC SHIELDING EFFECTIVENESS; WOOD-BASED COMPOSITES;

ELECTROMAGNETIC SHIELDING;

COATINGS; CORROSION PREVENTION; DEPOSITION; NICKEL; PH; PHOTOELECTRONS; SCANNING ELECTRON MICROSCOPY; VENEERS; X RAY DIFFRACTION;

EID: 84887138499     PISSN: None     EISSN: 19302126     Source Type: Journal    
DOI: 10.15376/biores.8.4.6097-6110     Document Type: Article

References (32)

1. Abdel Hameed, R. M., and Fekry, A. M. (2010). "Electrochemical impedance studies of modified Ni-P and Ni-Cu-P deposits in alkaline medium," Electrochimica Acta 55(20), 5922-5929.
2. Gao, G. Q., and Huang, J. T. (2007). "The effect factor analysis of the nickel activation techniques on the uniformity of the plating layer in wood electroless nickel plating," Journal of Inner Mongolia Agricultural University 28, 95-98.
3. Guo, R. H., Jiang, S. Q., Yuen, C. W. M., and Ng, M. C. F. (2009). "Effect of copper content on the properties of Ni-Cu-P plated polyester fabric," Journal of Applied Electrochemistry 39(6), 907-912.
4. Hu, G. H., Wu, H. H., and Yang, F. Z. (2006). "Electroless nickel plating on carbon nanotube with non-palladium activation process," Electrochemistry 12(1), 25-28.
5. Huang, J. T., and Zhao, G. J. (2004). "Electroless plating of wood," Journal of Beijing Forestry University 3, 88-92.
6. Krasteva, N., Fotty, V., and Armyanov, S. (1994). "Thermal stability of Ni-P and Ni-Cu-P amorphous alloys," Journal of the Electrochemical Society 141(10), 2864-2867.
7. Lai, D. Z., Chen, W. X., Yao, Y. F., and Liu, G. F. (2006). "Novel activation method using chemical plating on the fabric," Journal of Textile Research 27(1), 34-37.
8. Li, J., Wang, L. J., and Liu, H. B. (2010). "A new process for preparing conducting wood veneers by electroless nickel plating," Surface and Coatings Technology 204(8), 1200-1205.
9. Li, L. B., An, M. Z., and Wu, G. H. (2006). "A new electroless nickel deposition technique to metallise SiCp/Al composites," Surface and Coatings Technology 200(16), 5102-5112.
10. Li, L. B., and An, M. Z. (2008). "Electroless nickel-phosphorus plating on SiCp/Al composite from acid bath with nickel activation," Journal of Alloys and Compounds 461(1), 85-91.
11. Lin, W. S, and Huang, W. H. (2003). "Electroless nickel plating on glass substrate by palladium-free activation," Chinese Journal of Applied Chemistry 20(5), 018.
12. Liu, H., Guo, R. X., Liu, Y., Thompson, G. E., and Liu, Z. (2012). "The effect of processing gas on corrosion performance of electroless Ni-W-P coatings treated by laser," Surface and Coatings Technology 206(15), 3350-3359.
13. Liu, H., Li, J., and Wang, L. J. (2010). "Electroless nickel plating on APTHS modified wood veneer for EMI shielding," Applied Surface Science 257(4), 1325-1330.
14. Nagasawa, C., and Kumagai, Y. (1989). "Electromagnetic shielding particleboards with nickel-plated wood particle," Journal of Wood Science 35(12), 1092-1099.
15. Nagasawa, C., Kumagai, Y., and Urabe, K. (1990). "Electromagnetic shielding effectiveness of particleboard containing nickel-metalized wood-particles in the core layer," Journal of Wood Science 36(7), 531-537.
16. Nagasawa, C., Kumagai, Y., and Urabe, K. (1991a). "Electroconductivity and electromagnetic-shielding effectiveness of nickel-plated veneer," Journal of Wood Science 37(2), 158-163.
17. Nagasawa, C., Kumagai, Y., Koshizaki, N., and Kanbe, T. (1992). "Changes in electromagnetic shielding properties of particleboards made of nickel-plated wood particles formed by various pre-treatment processes," Journal of Wood Science 38(3), 256-263.
18. Nagasawa, C., Kumagai, Y., Urabe, K., and Shinagawa, S. (1999). "Electromagnetic shielding particle board with nickel-plated wood particles," Journal of Porous Materials 6(3), 247-254.
19. Nagasawa, C., Umehara, H., and Koshizaki, N. (1991b). "Effects of wood species on electroconductivity and electromagnetic shielding properties of electrolessly plated sliced veneer with nickel," Journal of Wood Science 40(10), 1092-1099.
20. Ranganatha, S., Venkatesha, T. V., and Vathsala, K. (2012). "Process and properties of electroless Ni-Cu-P-ZrO2 nanocomposite coatings," Materials Research Bulletin 47(3), 635-645.
21. Sha, W., Wu, X., and Keong, K. G. (2011). Electroless Copper and Nickel-Phosphorus Plating: Processing, Characterisation and Modeling, Woodhead Publishing, Cambridge, UK.
22. Shao, Q., Yang, Y. X., Ge, S. S., and Zheng, H. (2007). "Study on electroless nickel plating activated without palladium on the surface of cenospheres," Journal of Functional Materials 38(12), 2001.
23. Sun, L., Li, J., and Wang, L. J. (2012). "Electromagnetic interference shielding material from electroless copper plating on birch veneer," Wood Science and Technology 46(6), 1061-1071.
24. Valova, E., Dille, J., Armyanov, S., Georgieva, J., Tatchev, D., Marinov, M., Delphancke J.-L., Steenhaut, O., and Hubin, A. (2005). "Interface between electroless amorphous Ni-Cu-P coatings and Al substrate," Surface and Coatings Technology 190(2), 336-344.
25. Wang, L. J, Sun, L., and Li, J. (2011b). "Electroless copper plating on Fraxinus mandshurica veneer using glyoxylic acid as reducing agent," BioResources 6(3), 3493-3504.
26. Wang, L. J., and Li, J. (2007). "Ultrasound-assisted electroless plating Ni-P alloy on the surface of birch veneer," Scientia Silvae Sinicae 12, 311-315.
27. Wang, L. J., and Liu, H. B. (2011c). "Electroless nickel plating on chitosan-modified wood veneer," BioResources 6(2), 2045-2054.
28. Wang, L. J., Li, J., and Liu, H. B. (2011a). "A simple process for electroless plating nickel-phosphorus film on wood veneer," Wood Science and Technology 45(1), 161-167.
29. Wang, L. J., Li, J., and Liu, Y. X. (2006a). "Electroless nickel plating on poplar veneer," Fine Chemicals 23(3), 230-233.
30. Wang, L. J., Li, J., and Liu, Y. X. (2006b). "Preparation of electromagnetic shielding wood-metal composite by electroless nickel plating," Journal of Forestry Research 17(1), 53-56.
31. Wang, L. J., Li, J., and Liu, Y. X. (2008). "Study on preparation of electromagnetic shielding composite by electroless copper plating on Fraxinus mandshurica veneer," Journal of Material Engineering (4), 56-60.
32. Yu, H. S., Luo, S. F., and Wang, Y. R. (2001). "A comparative study on the crystallization behavior of electroless Ni-P and Ni-Cu-P deposits," Surface and Coatings Technology 148(2), 143-148.