Electrochemical impedance studies of modified Ni-P and Ni-Cu-P deposits in alkaline medium

Electrochimica Acta

Volumn 55, Issue 20, 2010, Pages 5922-5929

  Abdel Hameed, R M ^a   Fekry, A M ^a  

^a CAIRO UNIVERSITY   (Egypt)

Author keywords

EIS; KOH; Ni Cu P coating; Ni P coating; SEM

Indexed keywords

ALKALINE MEDIUM; CORROSION CURRENT DENSITIES; DEPOSITION TIME; EDX ANALYSIS; EFFECT OF PH; EIS; ELECTROCHEMICAL IMPEDANCE; ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY MEASUREMENTS; ELECTROCHEMICAL PERFORMANCE; IMPEDANCE CHARACTERISTICS; KOH SOLUTION; NI-CU-P; NI-P COATING; NI-P DEPOSITS; PLATING BATH; SEM; XRD;

CHEMICAL VAPOR DEPOSITION; COATINGS; CORROSION RESISTANCE; CYCLIC VOLTAMMETRY; DEPOSITS; ELECTROCHEMICAL CORROSION; ELECTROLESS PLATING; ELECTROPLATING; PH EFFECTS; PHOSPHORUS;

ELECTROCHEMICAL IMPEDANCE SPECTROSCOPY;

EID: 77954174232     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2010.05.046     Document Type: Article

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