Interface between electroless amorphous Ni-Cu-P coatings and Al substrate

Surface and Coatings Technology

Volumn 190, Issue 2-3, 2005, Pages 336-344

  Valova, E ^a   Dille, J ^b   Armyanov, S ^a   Georgieva, J ^a   Tatchev, D ^a   Marinov, M ^a   Delplancke, J L ^b   Steenhaut, O ^c   Hubin, A ^c  

^a INSTITUTE OF PHYSICAL CHEMISTRY   (Bulgaria)

^b UNIVERSITÉ LIBRE DE BRUXELLES   (Belgium)

^c VRIJE UNIVERSITEIT BRUSSEL   (Belgium)

Author keywords

AES; Amorphous Ni Cu P alloy; Coating substrate interface; Electroless deposition; TEM

Indexed keywords

ALUMINUM; AMORPHOUS MATERIALS; AUGER ELECTRON SPECTROSCOPY; COMPOSITION; CRYSTAL LATTICES; ELECTROLESS PLATING; ELECTRON DIFFRACTION; ENERGY DISPERSIVE SPECTROSCOPY; INTERFACES (MATERIALS); NICKEL; PHOSPHORUS; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM SUBSTRATES; AMORPHOUS STRUCTURE; CRYSTALLITES; LATTICE STRUCTURE;

COATINGS;

COATING;

EID: 10144261308     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2004.03.050     Document Type: Article

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