Improving aluminum nitride plasma etch process for MEMS applications

Journal of Micromechanics and Microengineering

Volumn 23, Issue 11, 2013, Pages

  Bliznetsov, Vladimir ^a   Johari, Badrul Hisam Bin ^a   Chentir, Mohamed Tahar ^a   Li, Wei Hong ^a   Wong, Lai Yin ^a   Merugu, Srinivas ^a   Zhang, Xiao Lin ^a   Singh, Navab ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE (ALN); CONTOUR-MODE RESONATORS; ETCHED SURFACE ROUGHNESS; INDUCTIVELY COUPLED-PLASMA REACTIVE ION ETCHING; MEMS APPLICATIONS; METAL ELECTRODES; PLASMA ETCH PROCESS; RF MICROELECTROMECHANICAL SYSTEMS;

ALUMINUM NITRIDE; CHLORINE; INDUCTIVELY COUPLED PLASMA; OPTIMIZATION; PIEZOELECTRICITY; SURFACE ROUGHNESS;

MOLYBDENUM;

EID: 84887112769     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/23/11/117001     Document Type: Article

References (7)

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