Centip3De: A many-core prototype exploring 3d integration and near-threshold computing

Communications of the ACM

Volumn 56, Issue 11, 2013, Pages 97-104

  Dreslinski, Ronald G ^a   Fick, David ^a   Giridhar, Bharan ^a   Kim, Gyouho ^a   Seo, Sangwon ^a   Fojtik, Matthew ^a   Satpathy, Sudhir ^a   Lee, Yoonmyung ^a   Kim, Daeyeon ^a   Liu, Nurrachman ^a   Wieckowski, Michael ^a   Chen, Gregory ^a   Sylvester, Dennis ^a   Blaauw, David ^a   Mudge, Trevor ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3D STACKING TECHNOLOGY; CHIP MULTIPROCESSOR; EXPONENTIAL INCREASE; GLOBAL INTERCONNECTS; NEAR-THRESHOLD COMPUTING; PERFORMANCE GAIN; THREE DIMENSIONAL (3D) INTEGRATION; THROUGH SILICON VIAS;

DESIGN; INTEGRATION; INTERCONNECTION NETWORKS; SILICON;

THREE DIMENSIONAL;

EID: 84887089342     PISSN: 00010782     EISSN: 15577317     Source Type: Journal    
DOI: 10.1145/2524713.2524725     Document Type: Article

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