Evaluation of silver-sintering die attach

2012 7th International Conference on Integrated Power Electronics Systems, CIPS 2012

Volumn , Issue , 2012, Pages

  Sabbah, W ^a,b,c   Riva, R ^c   Hascoet, S ^c   Buttay, C ^c   Azzopardi, S ^b   Woirgard, E ^b   Planson, D ^c   Allard, B ^c   Meuret, R ^a  

^a SAFRAN AIRCRAFT ENGINES   (France)

^b UNIVERSITÉ DE BORDEAUX   (France)

^c UNIVERSITÉ DE LYON   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ELEVATED TEMPERATURE; HIGH TEMPERATURE POWER ELECTRONICS; HIGH TEMPERATURE STABILITY; PROCESS PARAMETERS; SILVER PASTES; STABILITY TESTS; TEST VEHICLE; VOLTAGE BIAS;

ELECTRONICS PACKAGING; POWER ELECTRONICS; SILVER;

SINTERING;

EID: 84881116314     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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