Identification and quantification of FOUP molecular contaminants inducing defects in integrated circuits manufacturing

Microelectronic Engineering

Volumn 105, Issue , 2013, Pages 124-129

  Nguyen, Thi Quynh ^a,b   Fontaine, Hervé ^a   Borde, Yannick ^b   Jacob, Véronique ^c  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

^c UNIV GRENOBLE ALPES   (France)

Author keywords

Acetic acid; AMC; Cross contamination; Dry Stripping; Etching; Formic acid; HF

Indexed keywords

ACETIC ACID; DEFECTS; ETCHING; FORMIC ACID; HAFNIUM; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATED CIRCUITS; MANUFACTURE; SEMICONDUCTOR DEVICE MANUFACTURE; TIMING CIRCUITS;

CONTAMINATED ENVIRONMENT; COPPER INTERCONNECTS; CROSS CONTAMINATION; MOLECULAR CONTAMINANTS; MOLECULAR CONTAMINATION; ORGANIC COMPOSITIONS; ORGANIC CONTAMINANT; SEMICONDUCTOR INDUSTRY;

CONTAMINATION;

EID: 84886799088     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2012.04.008     Document Type: Article

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