Impact of the volatile acid contaminants on copper interconnects electrical performances

ECS Transactions

Volumn 25, Issue 5, 2009, Pages 79-86

  Fontaine, H ^a   Feldis, H ^b   Danel, A ^a   Cetre, S ^a   Ailhas, C ^a  

^a CEA LETI   (France)

^b STMICROELECTRONICS   (France)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE COMPOUNDS; COPPER; INTEGRATED CIRCUIT INTERCONNECTS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICES;

BASE STRUCTURE; COPPER INTERCONNECTS; CU INTERCONNECT; ELECTRICAL PERFORMANCE; IMPACT INTENSITY; THRESHOLD LEVELS; VIA RESISTANCE; VOLATILE ACIDS;

CONTAMINATION;

EID: 74949121650     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3202638     Document Type: Conference Paper

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