Study of the volatile organic contaminants absorption and their reversible outgassing by FOUPs

Solid State Phenomena

Volumn 145-146, Issue , 2009, Pages 143-146

  Fontaine, Hervé ^a   Cetre, Sylviane ^a   Veillerot, Marc ^a   Danel, Adrien ^a  

^a CEA LETI   (France)

Author keywords

AMC; Cross contamination; Polymer

Indexed keywords

DEGASSING; SILICON WAFERS; VOLATILE ORGANIC COMPOUNDS;

AIRBORNE MOLECULAR CONTAMINANTS; AMC; CROSS CONTAMINATION; CU LAYERS; IC MANUFACTURING; MOLECULAR CONTAMINATION; ORGANIC CONTAMINANT; POROUS POLYMERS; VOLATILE ACIDS; VOLATILE COMPOUNDS;

CONTAMINATION;

EID: 74949108212     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.145-146.143     Document Type: Conference Paper

References (7)

1. H. Habuka, Y. Shimazaki & al. Time-dependent airborne organic contamination on silicon wafer surface stored in a plastic box. Jpn J. Appl. Phys., 42, pp1575-1580 (2003).
2. R.J. Holmes, A. Tram & al. Purge gases for removal of airborne molecular contamination during the storage and transport of silicon wafers. Semiconductor Manufacturing, pp28-33, (dec. 2004).
3. T. Kamoshima & al. Ambient gas control in slot-to-slot space inside FOUP to suppress Cu-loss after dual damascene patterning. Proc. of ISSM 2007, pp467-470, Santa Clara CA, USA (2007).
4. H. Fontaine, M. Veillerot. Plastic containers contamination by volatile acids: accumulation, release and transfer to Cu-surfaces during wafers storage. Solid State Phenomena, vol. 134, pp251-254 (2008).
5. M.Veillerot, H. Fontaine, S. Cetre, F. Tardif. A method for airborne organic contamination concentration determination inside wafers containers. Proc. of MIMS, Santa Clara, (2003).
6. ASTM F-1982, "Standard test methods for analysing organic contaminants on silicon wafer surfaces by Thermal Desorption Gas Chromatography", ASTM, USA (1999).
7. M.H. Klopffer & B. Flaconnèche. Transport properties of gases in polymers: bibliographic review. Oil & gas science and technology - rev. IFP, vol.56 (2001), no3 pp. 223-244.