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Volumn 21, Issue 4, 2008, Pages 573-577
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Controlling ambient gas in slot-to-slot space inside FOUP to suppress cu-loss after dual damascene patterning
c
HITACHI LTD
(Japan)
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Author keywords
Copper; Dual damascene; Etching; Fluorine; Inter connect; Oxidation
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Indexed keywords
CHEMICAL OXYGEN DEMAND;
ETCHING;
FLUORINE;
GASES;
OXIDATION;
AMBIENT GASSES;
DAMASCENE PATTERNING;
DUAL DAMASCENES;
DUAL-DAMASCENE;
INTER-CONNECT;
OXIDATION MODELS;
QUEUE TIMES;
WET CLEANINGS;
COPPER;
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EID: 55649113982
PISSN: 08946507
EISSN: None
Source Type: Journal
DOI: 10.1109/TSM.2008.2005343 Document Type: Conference Paper |
Times cited : (25)
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References (5)
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