Plastic containers contamination by volatile acids: Accumulation, release and transfer to Cu-surfaces during wafers storage

Solid State Phenomena

Volumn 134, Issue , 2008, Pages 251-254

  Fontaine, Hervé ^a   Veillerot, Marc ^a  

^a CEA GRENOBLE   (France)

Author keywords

AMC; Cross contamination; FOUP; Outgassing; Polymeric material

Indexed keywords

EID: 38549153801     PISSN: 10120394     EISSN: 16629779     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/SSP.134.251     Document Type: Conference Paper

References (5)

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2. R. J. Holmes, A. Tram & al. Purge gases for removal of airborne molecular contamination during the storage and transport of silicon wafers. Semiconductor Manufacturing, (dec. 2004), pp28-33.
3. H. Fontaine, M. Veillerot & A. Danel. Deposition behavior of volatile acidic contaminants on metallic interconnect surfaces. Solid State Phenomena, 103-104 (2005), pp 365-368.
4. P. Sun, M. Adams, L. Shive, S. Pirooz. Molecular and ionic contamination monitoring for cleanroom air and wafer surfaces. SPIE vol. 3215, 118-127, (1997).
5. M. H. Klopffer & B. Flaconnèche. Transport properties of gases in polymers: bibliographic review. Oil & gas science and technology-rev. IFP, vol. 56 (2001), no. 3 pp. 223-244.