Microchannel cooling device with perforated side walls: Design and modeling

International Journal of Heat and Mass Transfer

Volumn 68, Issue , 2014, Pages 174-183

  Warrier, Gopinath R ^a   Kim, Chang Jin ^a   Sungtaek Ju, Y ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

Electronics cooling; High heat flux; Microchannel

Indexed keywords

DESIGN AND MODELING; ELECTRONICS COOLING; FLOW INSTABILITIES; HIGH ASPECT RATIO; HIGH HEAT FLUX; MICRO-PERFORATIONS; MICROCHANNEL COOLING; OPTOELECTRONIC SEMICONDUCTOR DEVICES; EXTENDED SURFACES;

ASPECT RATIO; ELECTRONIC COOLING; LIQUIDS; THERMONUCLEAR REACTIONS; VAPORS; WALL FLOW; COOLING; FINITE ELEMENT METHOD; MICROCHANNELS; SEMICONDUCTOR DEVICE MODELS; SEMICONDUCTOR DEVICES;

MICROCHANNELS; HEAT FLUX;

EID: 84885391268     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijheatmasstransfer.2013.09.022     Document Type: Article

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