Metal deposition by electroless plating on polydopamine functionalized micro- and nanoparticles

Journal of Colloid and Interface Science

Volumn 411, Issue , 2013, Pages 187-193

  Mondin, Giovanni ^a   Wisser, Florian M ^a   Leifert, Annika ^a   Mohamed Noriega, Nasser ^a   Grothe, Julia ^a   Dörfler, Susanne ^a   Kaskel, Stefan ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Al2O3; Copper; Electroless plating; Metal matrix composites; Nanoparticles; Polydopamine; Silver; WC

Indexed keywords

ALUMINA NANOPARTICLE; ELECTRICAL CONTACTS; ELECTROLESS METAL DEPOSITION; ELECTROMAGNETIC INTERFERENCE SHIELDING; FUNCTIONALIZATIONS; POLYDOPAMINE; SELF-POLYMERIZATION; WC;

ALUMINA; AUTOMOTIVE INDUSTRY; COPPER; DEPOSITION; ELECTROLESS PLATING; ELECTROMAGNETIC PULSE; METAL COATINGS; METAL IONS; METAL NANOPARTICLES; METALLIC MATRIX COMPOSITES; NANOPARTICLES; POLYMERIZATION; TUNGSTEN; TUNGSTEN CARBIDE;

SILVER;

ALUMINUM OXIDE; AMINO ACID; CATECHOL DERIVATIVE; COPPER; DOPAMINE DERIVATIVE; METAL; METAL ION; NANOPARTICLE; POLYDOPAMINE; POLYMER; SILVER; TUNGSTEN; UNCLASSIFIED DRUG;

ARTICLE; COMPOSITE MATERIAL; COST EFFECTIVENESS ANALYSIS; MAGNET; NANOFABRICATION; POLYMERIZATION; PRIORITY JOURNAL; SENSITIZATION; WETTABILITY;

AL(2)O(3); COPPER; ELECTROLESS PLATING; METAL MATRIX COMPOSITES; NANOPARTICLES; POLYDOPAMINE; SILVER; WC;

INDOLES; METALS; MICROSCOPY, ELECTRON, SCANNING; MICROSCOPY, ELECTRON, TRANSMISSION; NANOPARTICLES; POLYMERS; X-RAY DIFFRACTION;

EID: 84885066662     PISSN: 00219797     EISSN: 10957103     Source Type: Journal    
DOI: 10.1016/j.jcis.2013.08.028     Document Type: Article

References (51)

1. Jankiewicz B.J., Jamiola D., Choma J., Jaroniec M. Adv. Colloid Interface Sci. 2012, 170:28.
2. Stroumbouli M., Gyftou P., Pavlatou E.A., Spyrellis N. Surf. Coat. Technol. 2005, 195:325.
3. Michalski J., Konopka K., Trzaska M. Mater. Chem. Phys. 2003, 81:407.
4. Tjong S.C. Adv. Eng. Mater. 2007, 9:639.
5. Ibrahim I.A., Mohamed F.A., Lavernia E.J. J. Mater. Sci. 1991, 26:1137.
6. Miracle D.B. Compos. Sci. Technol. 2005, 65:2526.
7. Leon C.A., Drew R.A.L. J. Mater. Sci. 2000, 35:4763.
8. Asthana R. J. Mater. Sci. 1998, 33:1959.
9. Cline J.E., Wulf J. J. Electrochem. Soc. 1951, 98:385.
10. Yu X., Xu Z., Shen Z. J. Phys. D: Appl. Phys. 2007, 40:2894.
11. Jiang Z., Liu C. J. Phys. Chem. B 2003, 107:12411.
12. Chen Y., Cao M., Xu Q., Zhu J. Surf. Coat. Technol. 2003, 172:90.
13. Sharma R., Agarwala R.C., Agarwala V. Appl. Surf. Sci. 2006, 252:8487.
14. Zou G., Cao M., Lin H., Jin H., Kang Y., Chen Y. Powder Technol. 2006, 168:84.
15. Qiu T., Chu P.K. Mater. Sci. Eng. R Rep. 2008, 61:59.
16. Aldakov D., Bonnassieux Y., Geffroy B., Palacin S. Appl. Mater. Interfaces 2009, 1:584.
17. Deng Z., Chen M., Wu L. J. Phys. Chem. C 2007, 111:11692.
18. Cohen R.L., West K.W. J. Electrochem. Soc. 1973, 120:502.
19. Mondin G., Schumm B., Fritsch J., Grothe J., Kaskel S. Microelectron. Eng. 2013, 104:100.
20. Carmichael T.B., Vella S.J., Afzali A. Langmuir 2004, 20:5593.
21. Osaka T., Yoshino M. Electrochim. Acta 2007, 53:271.
22. Lee H., Dellatore S.M., Miller W.M., Messersmith P.B. Science 2007, 318:426.
23. Fei B., Qian B., Yang Z., Wang R., Liu W.C., Mak C.L., Xin J.H. Carbon 2008, 46:1795.
24. Jiang Y., Lu Y., Zhang L., Liu L., Dai Y., Wang W. J. Nanopart. Res. 2012, 14:938.
25. Ryou M.-H., Lee Y.M., Park J.-K., Choi J.W. Adv. Mater. 2011, 23:3066.
26. Cui J., Wang Y., Postma A., Hao J., Hosta-Rigau L., Caruso F. Adv. Funct. Mater. 2010, 20:1625.
27. Yu B., Wang D.A., Ye Q., Zhou F., Liu W. Chem. Commun. 2009, 44:6789.
28. Kang S.M., You I., Cho W.K., Shon H.K., Lee T.G., Choi I.S., Karp J.M., Lee H. Angew. Chem. Int. Ed. 2010, 49:9401.
29. Zhang L., Wu J., Wang Y., Long Y., Zhao N., Xu J. J. Am. Chem. Soc. 2012, 134:9879.
30. Ye W., Wang D., Zhang H., Zhou F., Liu W. Electrochim. Acta 2010, 55:2004.
31. Ball V., Nguyen I., Haupt M., Oehr C., Arnoult C., Toniazzo V., Ruch D. J. Colloid Interface Sci. 2011, 364:359.
32. Ball V., Del Frari D., Toniazzo V., Ruch D. J. Colloid Interface Sci. 2012, 386:366.
33. Liu Y., Yua B., Hao J., Zhou F. J. Colloid Interface Sci. 2011, 362:127.
34. Li H., Cui D., Cai H., Zhang L., Chen X., Sun J., Chao Y. Biosens. Bioelectron. 2013, 41:809.
35. Si J., Yang H. Mater. Chem. Phys. 2011, 128:519.
36. Zhou W.-H., Lu C.-H., Guo X.-C., Chen F.-R., Yang H.-H., Wang X.-R. J. Mater. Chem. 2010, 20:880.
37. Li Q., Tian M., Liu L., Zou H., Zhang L., Wang W.C. Electrochim. Acta 2013, 91:114.
38. Wang W., Jiang Y., Liao Y., Tian M., Zou H., Zhang L. J. Colloid Interface Sci. 2011, 358:567.
39. Yu F., Chen S., Chen Y., Li H., Yang L., Chen Y., Yin Y. J. Mol. Struct. 2010, 982:152.
40. Yin X.-B. J. Chromatogr. A 2008, 1212:130.
41. Dreyer D.R., Miller D.J., Freeman B.D., Paul D.R., Bielawski C.W. Langmuir 2012, 28:6428.
42. Ouyang R., Lei J., Ju H. Nanotechnology 2010, 21:185502.
43. Jiang J.-H., Zhu L.-P., Li X.-L., Xu Y.-Y., Zhu B.-K. J. Membrane Sci. 2010, 364:194.
44. Ribeiro C.A., de Souza W.R., Spirandeli Crespi M., Gomes Neto J.A., Fertonani F.L. J. Therm. Anal. Calorim. 2007, 90:801.
45. Vaidya S.D., Thakkar N.V. J. Phys. Chem. Solids 2001, 62:977.
46. Wisser F.M., Abele M., Gasthauer M., Müller K., Moszner N., Kickelbick G. J. Colloid Interface Sci. 2012, 374:77.
47. Mondin G., Schumm B., Fritsch J., Hensel R., Grothe J., Kaskel S. Mater. Chem. Phys. 2013, 137:884.
48. Djokic S., Nikolic N., Zivkovic P., Popov K., Djokic N. ECS Trans. 2011, 33:7.
49. Schumm B., Wisser F.M., Mondin G., Hippauf F., Fritsch J., Grothe J., Kaskel S. J. Mater. Chem. C 2013, 1:638.
50. Fritsch J., Schumm B., Biedermann R., Grothe J., Kaskel S. Eur. J. Inorg. Chem. 2012, 5:878.
51. Schneider M., Weiser M., Doerfler S., Althues H., Kaskel S., Michaelis A. Surf. Eng. 2012, 28:435.