Development of copper coatings on ceramic powder by electroless technique

Applied Surface Science

Volumn 252, Issue 24, 2006, Pages 8487-8493

  Sharma, Rahul ^a   Agarwala, R C ^a   Agarwala, V ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY ROORKEE   (India)

Author keywords

Adherence; Chemical bonding; EL; Electroless coating; Interface; Mechanical bonding; Porosity

Indexed keywords

CHEMICAL BONDS; COATING TECHNIQUES; COPPER; PH EFFECTS; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC PROPERTIES; X RAY DIFFRACTION;

ADHERENCE; CHEMICAL BONDING; ELECTROLESS COATING; MECHANICAL BONDING;

POWDER METALS;

EID: 33748977440     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2005.11.085     Document Type: Article

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