SCOPUS 정보 검색 플랫폼

Journal of Alloys and Compounds

Volumn 582, Issue , 2014, Pages 408-413

Solid state diffusion between Sn and Cu microcones on Cu microcones

(6) Huang, Yi a Hang, Tao a Hu, Anmin a Chen, Zhuo a Lu, Qin a Li, Ming a

a SHANGHAI JIAO TONG UNIVERSITY (China)

Author keywords

Cu microcones; Diffusion; Intermetallics; Kinetic; Low temperature bonding

Indexed keywords

BONDING; CRYSTAL ORIENTATION; DIFFUSION IN SOLIDS; GRAIN BOUNDARIES; GRAIN GROWTH; INTERMETALLICS; KINETICS; LOW TEMPERATURE OPERATIONS; TEMPERATURE; TIN;

BONDING TEMPERATURES; GRAIN-BOUNDARY DIFFUSION; GROWTH OF INTERMETALLICS; LOW TEMPERATURE BONDING; MICROCONES; RATE-CONTROLLING PROCESS; SOLID-STATE DIFFUSION; THEORETICAL STUDY;

DIFFUSION;

EID: 84883510564 PISSN: 09258388 EISSN: None Source Type: Journal
DOI: 10.1016/j.jallcom.2013.08.076 Document Type: Article

Times cited : (14)

References (18)

1
- 84884353021
- Q. Lu, Z. Chen, W. Zhang, A. Hu, M. Li, Appl. Surf. Sci. (2012).
- Appl. Surf. Sci , vol.2012
- Lu, Q.¹ Chen, Z.² Zhang, W.³ Hu, A.⁴ Li, M.⁵

2
- 84855873096
- C.-T. Ko, K.-N. Chen, Microelectron. Reliab. 52 (2012) 302-311.
- (2012) Microelectron. Reliab , vol.52 , pp. 302-311
- Ko, C.-T.¹ Chen, K.-N.²

3
- 81355149315
- R.I. Made, C.L. Gan, L. Yan, K.H.B. Kor, H.L. Chia, K.L. Pey, C.V. Thompson, Acta Mater. 60 (2012) 578-587.
- (2012) Acta Mater , vol.60 , pp. 578-587
- Made, R.I.¹ Gan, C.L.² Yan, L.³ Kor, K.H.B.⁴ Chia, H.L.⁵ Pey, K.L.⁶ Thompson, C.V.⁷

4
- 84884225125
- Z. Yang, W. Zhou, P. Wu, J. Alloys Comp. 581 (2013) 202-205.
- (2013) J. Alloys Comp , vol.581 , pp. 202-205
- Yang, Z.¹ Zhou, W.² Wu, P.³

5
- 84879249514
- J. Shen, M. Zhao, P. He, Y. Pu, J. Alloys Comp. 574 (2013) 451-458.
- (2013) J. Alloys Comp , vol.574 , pp. 451-458
- Shen, J.¹ Zhao, M.² He, P.³ Pu, Y.⁴

6
- 79551497494
- B. Wang, F. Wu, Y. Wu, B. An, H. Liu, J. Zou, Solder. Surf. Mt. Technol. 23 (2011) 40-46.
- (2011) J. Zou, Solder. Surf. Mt. Technol , vol.23 , pp. 40-46
- Wang, B.¹ Wu, F.² Wu, Y.³ An, B.⁴ Liu, H.⁵

7
- 84867237728
- C.-P. Lin, C.-M. Chen, J. Alloys Comp. 547 (2013) 37-42.
- (2013) J. Alloys Comp , vol.547 , pp. 37-42
- Lin, C.-P.¹ Chen, C.-M.²

8
- 84882639204
- C. Li, Z. Zhu, L. Liao, M. Dai, C. Liu, C. Kao, Sci. Technol. Weld. Joi. 4 (2013) 421- 424.
- (2013) Sci. Technol. Weld. Joi , vol.4 , pp. 421-424
- Li, C.¹ Zhu, Z.² Liao, L.³ Dai, M.⁴ Liu, C.⁵ Kao, C.⁶

9
- 80054860891
- W. Zhang, Z. Yu, Z. Chen, M. Li, Mater. Lett. 67 (2012) 327-330.
- (2012) Mater. Lett , vol.67 , pp. 327-330
- Zhang, W.¹ Yu, Z.² Chen, Z.³ Li, M.⁴

10
- 15944399686
- T. Takenaka, S. Kano, M. Kajihara, N. Kurokawa, K. Sakamoto, Mater. Sci. Eng. A 396 (2005) 115-123.
- (2005) Mater. Sci. Eng. A , vol.396 , pp. 115-123
- Takenaka, T.¹ Kano, S.² Kajihara, M.³ Kurokawa, N.⁴ Sakamoto, K.⁵

11
- 84871449932
- Y. Tang, G.Y. Li, Y.C. Pan, J. Alloys Comp. 554 (2013) 195-203.
- (2013) J. Alloys Comp , vol.554 , pp. 195-203
- Tang, Y.¹ Li, G.Y.² Pan, Y.C.³

12
- 38649107846
- T. Hang, M. Li, Q. Fei, D. Mao, Nanotechnology 19 (2008) 035201.
- (2008) Nanotechnology , vol.19 , pp. 035201
- Hang, T.¹ Li, M.² Fei, Q.³ Mao, D.⁴

13
- 0015614563
- K.N. Tu, Acta Metall. 21 (1973) 347-354.
- (1973) Acta Metall , vol.21 , pp. 347-354
- Tu, K.N.¹

14
- 84875943318
- Q. Li, Y.C. Chan, J. Alloys Comp. 567 (2013) 47-53.
- (2013) J. Alloys Comp , vol.567 , pp. 47-53
- Li, Q.¹ Chan, Y.C.²

15
- 4944243895
- J.-W. Yoon, Y.-H. Lee, D.-G. Kim, H.-B. Kang, S.-J. Suh, C.-W. Yang, C.-B. Lee, J.-M. Jung, C.-S. Yoo, S.-B. Jung, J. Alloys Comp. 381 (2004) 151-157.
- (2004) J Alloys Comp , vol.381 , pp. 151-157
- Yoon, J.-W.¹ Lee, Y.-H.² Kim, D.-G.³ Kang, H.-B.⁴ Suh, S.-J.⁵ Yang, C.-W.⁶ Lee, C.-B.⁷ Jung, J.-M.⁸ Yoo, C.-S.⁹ Jung, S.-B.¹⁰

16
- 33845309607
- R. Labie, W. Ruythooren, J. Van Humbeeck, Intermetallics 15 (2007) 396-403.
- (2007) Intermetallics , vol.15 , pp. 396-403
- Labie, R.¹ Ruythooren, W.² Van Humbeeck, J.³

17
- 23444447786
- M. Mita, M. Kajihara, N. Kurokawa, K. Sakamoto, Mater. Sci. Eng. A 403 (2005) 269-275.
- (2005) Mater. Sci. Eng. A , vol.403 , pp. 269-275
- Mita, M.¹ Kajihara, M.² Kurokawa, N.³ Sakamoto, K.⁴

18
- 1842666612
- T. Yamada, K. Miura, M. Kajihara, N. Kurokawa, K. Sakamoto, J. Mater. Sci. 39 (2004) 2327-2334.
- (2004) J. Mater. Sci , vol.39 , pp. 2327-2334
- Yamada, T.¹ Miura, K.² Kajihara, M.³ Kurokawa, N.⁴ Sakamoto, K.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.