Stress-strain analysis of single-lap composite joints under tension

Journal of Engineering Materials and Technology, Transactions of the ASME

Volumn 118, Issue 2, 1996, Pages 247-255

  Yang, Chihdar ^a   Pang, Su Seng ^a  

^a Louisiana State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BOUNDARY CONDITIONS; COMPOSITE STRUCTURES; COMPUTER SIMULATION; COMPUTER SOFTWARE; FINITE ELEMENT METHOD; JOINTS (STRUCTURAL COMPONENTS); LAMINATES; MATHEMATICAL MODELS; NUMERICAL METHODS; STRESS CONCENTRATION; STRESSES;

ADHESIVE BONDED COMPOSITE SINGLE LAP JOINTS; BONDED LAMINATES; COUPLING EFFECT; LAMINATED ANISOTROPIC PLATE THEORY; PEEL STRESS; SOFTWARE PACKAGE ALGOR; STRAIN DISTRIBUTION; STRESS STRAIN ANALYSIS; TENSION;

STRESS ANALYSIS;

EID: 0030125954     PISSN: 00944289     EISSN: 15288889     Source Type: Journal    
DOI: 10.1115/1.2804896     Document Type: Article

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