Analysis of interfacial thermal stresses of chip-substrate structure

International Journal of Solids and Structures

Volumn 38, Issue 9, 2001, Pages 1551-1562

  Feng, Yanying ^a   Wu, Linzhi ^b  

^a TSINGHUA UNIVERSITY   (China)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BOUNDARY CONDITIONS; ELECTRONICS PACKAGING; HEAT CONDUCTION; INTERFACES (MATERIALS); MICROPROCESSOR CHIPS; STRESS CONCENTRATION; SUBSTRATES;

INTERFACIAL THERMAL STRESSES;

THERMAL STRESS;

EID: 0035253991     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(00)00099-8     Document Type: Article

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