Mouldable all-carbon integrated circuits

Nature Communications

Volumn 4, Issue , 2013, Pages

  Sun, Dong Ming ^a,c   Timmermans, Marina Y ^b   Kaskela, Antti ^b   Nasibulin, Albert G ^b   Kishimoto, Shigeru ^a   Mizutani, Takashi ^a   Kauppinen, Esko I ^b   Ohno, Yutaka ^a,b  

^a NAGOYA UNIVERSITY   (Japan)

^b AALTO UNIVERSITY   (Finland)

^c INSTITUTE OF METAL RESEARCH   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON; PLASTIC;

CARBON; ELECTRONIC EQUIPMENT; MOBILITY; PLASTIC; SUBSTRATE;

ARTICLE; ELECTRONICS; INTEGRATED CIRCUIT; NANODEVICE; OSCILLATION; OSCILLATOR;

EID: 84882431849     PISSN: None     EISSN: 20411723     Source Type: Journal    
DOI: 10.1038/ncomms3302     Document Type: Article

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