Numerical estimation of fracture toughness from indentation-induced circumferential cracking in thin films on ductile substrates

International Journal of Solids and Structures

Volumn 50, Issue 20-21, 2013, Pages 3406-3417

  Steffensen, S ^a   Madsen, N D ^a   Jensen, H M ^a  

^a AARHUS UNIVERSITY   (Denmark)

Author keywords

Crack channeling; Energy release rate; FEM; Fracture toughness; Indentation induced fracture; Stress; Stress intensity factor; Thin hard films

Indexed keywords

CHANNELING CRACK; CIRCUMFERENTIAL CRACKS; DUCTILE SUBSTRATE; FINITE ELEMENT SIMULATIONS; HARD FILMS; INDENTATION DEPTH; INITIAL DEFECTS; NUMERICAL ESTIMATION;

ALUMINA; BRIDGE COMPONENTS; CRACKS; ENERGY RELEASE RATE; ESTIMATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; INDENTATION; STRESS INTENSITY FACTORS; STRESSES; SUBSTRATES; SURFACE DEFECTS; THIN FILMS;

FAILURE (MECHANICAL);

EID: 84880725118     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2013.06.009     Document Type: Article

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