Thermal transport in organic semiconducting polymers

Applied Physics Letters

Volumn 102, Issue 25, 2013, Pages

  Duda, John C ^a,b   Hopkins, Patrick E ^a   Shen, Yang ^a   Gupta, Mool C ^a  

^a University of Virginia   (United States)

^b SEAGATE TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

NEAR ROOM TEMPERATURE; ORGANIC SEMICONDUCTING POLYMERS; PERCOLATION THRESHOLDS; POLY(3-HEXYLTHIOPHENE-2 ,5-DIYL); POLY(STYRENE SULFONATE); POLY-3 ,4-ETHYLENEDIOXYTHIOPHENE; TEMPERATURE DEPENDENCE; TIME DOMAIN THERMOREFLECTANCE;

PHYSICAL PROPERTIES; PHYSICS;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 84879861865     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4812234     Document Type: Article

References (54)

1. H. Hoppe and N. S. Sariciftci, J. Mater. Res. 19, 1924 (2004). 10.1557/JMR.2004.0252
2. T. Kietzke, Adv. OptoElectron. 2007, 40285 10.1155/2007/40285.
3. P. W. M. Blom, V. D. Mihailetchi, L. J. A. Koster, and D. E. Markov, Adv. Mater. 19, 1551 (2007). 10.1002/adma.200601093
4. F. C. Krebs, T. Tromholt, and M. Jorgensen, Nanoscale 2, 873 (2010). 10.1039/b9nr00430k
5. F. C. Krebs, J. Fyenbo, and M. Jorgensen, J. Mater. Chem. 20, 8994 (2010). 10.1039/c0jm01178a
6. G. Li, V. Shrotriya, Y. Yao, and Y. Yang, J. Appl. Phys. 98, 043704 (2005). 10.1063/1.2008386
7. T. A. Bull, L. S. C. Pingree, S. A. Jenekhe, D. S. Ginger, and C. K. Luscombe, ACS Nano 3, 627 (2009). 10.1021/nn800878c
8. R. A. Marsh, J. M. Hodgkiss, S. Albert-Seifried, and R. H. Friend, Nano Lett. 10, 923 (2010). 10.1021/nl9038289
9. Y. Shen, K. Li, N. Majumdar, J. C. Campbell, and M. C. Gupta, Sol. Energy Mater. Sol. Cells 95, 2314 (2011) 10.1016/j.solmat.2011.03.046.
10. D. Chen, A. Nakahara, D. Wei, D. Nordlund, and T. P. Russell, Nano Lett. 11, 561 (2011). 10.1021/nl103482n
11. W. Wang, Z. Wang, J. Tang, S. Yang, H. Jin, G.-L. Zhao, and Q. Li, J. Renewable Sustainable Energy 1, 023104 (2009). 10.1063/1.3106303
12. B. Zhang, J. Sun, H. E. Katz, F. Fang, and R. L. Opila, Appl. Mater. Interfaces 2, 3170 (2010). 10.1021/am100654p
13. O. Bubnova, Z. U. Khan, A. Malti, S. Braun, M. Fahlman, M. Berggren, and X. Crispin, Nature Mater. 10, 429 (2011). 10.1038/nmat3012
14. C. Hu, M. Kiene, and P. S. Ho, Appl. Phys. Lett. 79, 4121 (2001). 10.1063/1.1419239
15. S. Shenogin, A. Bodapati, P. Keblinski, and A. J. H. McGaughey, J. Appl. Phys. 105, 034906 (2009). 10.1063/1.3073954
16. M. D. Losego, L. Moh, K. A. Arpin, D. G. Cahill, and P. V. Braun, Appl. Phys. Lett. 97, 011908 (2010). 10.1063/1.3458802
17. Y. Jin, C. Shao, J. Kieffer, K. P. Pipe, and M. Shtein, J. Appl. Phys. 112, 093503 (2012). 10.1063/1.4759286
18. J. A. Malen, K. Baheti, T. Tong, Y. Zhao, J. A. Hudgings, and A. Majumdar, J. Heat Transfer 133, 081601 (2011). 10.1115/1.4003545
19. S. Rausch, D. Rauh, C. Deibel, S. Vidi, and H. P. Ebert, Int. J. Thermophys. 34 (5), 820-830 (2013). 10.1007/s10765-012-1174-4
20. G. Chen, M. S. Dresselhaus, G. Dresselhaus, J.-P. Fleurial, and T. Caillat, Int. Mater. Rev. 48, 45 (2003). 10.1179/095066003225010182
21. M. S. Dresselhaus, G. Chen, M. Y. Tang, R. Yang, H. Lee, D. Wang, Z. Ren, J.-P. Fleurial, and P. Gogna, Adv. Mater. 19, 1043 (2007). 10.1002/adma. 200600527
22. A. Henry and G. Chen, Phys. Rev. B 79, 144305 (2009). 10.1103/PhysRevB.79.144305
23. S. Shen, A. Henry, J. Tong, R. Zheng, and G. Chen, Nat. Nanotechnol. 5, 251 (2010). 10.1038/nnano.2010.27
24. A. Einstein, Ann. Phys. 340, 679 (1911). 10.1002/andp.19113400903
25. D. G. Cahill and R. O. Pohl, Phys. Rev. B 35, 4067 (1987). 10.1103/PhysRevB.35.4067
26. D. G. Cahill, S. K. Watson, and R. O. Pohl, Phys. Rev. B 46, 6131 (1992). 10.1103/PhysRevB.46.6131
27. D. Chirvase, J. Parisi, J. C. Hummelen, and V. Dyakonov, Nanotechnology 15, 1317 (2004). 10.1088/0957-4484/15/9/035
28. H. Hoppe and N. S. Sariciftci, J. Mater. Chem. 16, 45 (2006). 10.1039/b510618b
29. M. Campoy-Quiles, T. Ferenczi, T. Agostinelli, P. G. Etchegoin, Y. Kim, T. D. Anthopoulos, P. N. Stavrinou, D. D. C. Bradley, and J. Nelson, Nature Mater. 7, 158 (2008). 10.1038/nmat2102
30. G. Dennler, M. C. Scharber, and C. J. Brabec, Adv. Mater. 21, 1323 (2009). 10.1002/adma.200801283
31. D. G. Cahill, Rev. Sci. Instrum. 75, 5119 (2004). 10.1063/1.1819431
32. A. J. Schmidt, X. Chen, and G. Chen, Rev. Sci. Instrum. 79, 114902 (2008). 10.1063/1.3006335
33. P. E. Hopkins, B. Kaehr, L. M. Phinney, T. P. Koehler, A. M. Grillet, D. Dunphy, F. Garcia, and C. J. Brinker, J. Heat Transfer 133, 061601 (2011). 10.1115/1.4003548
34. P. E. Hopkins, J. C. Duda, S. P. Clark, C. P. Hains, T. J. Rotter, L. M. Phinney, and G. Balakrishnan, Appl. Phys. Lett. 98, 161913 (2011). 10.1063/1.3581041
35. M. Shin, H. Kim, J. Park, S. Nam, K. Heo, M. Ree, C.-S. Ha, and Y. Kim, Adv. Funct. Mater. 20, 748 (2010). 10.1002/adfm.200901655
36. D. G. Cahill, K. Goodson, and A. Majumdar, J. Heat Transfer 124, 223 (2002). 10.1115/1.1454111
37. P. E. Hopkins, J. R. Serrano, L. M. Phinney, S. P. Kearney, T. W. Grasser, and C. T. Harris, J. Heat Transfer 132, 081302 (2010). 10.1115/1.4000993
38. Y. K. Koh, M.-H. Bae, D. G. Cahill, and E. Pop, Nano Lett. 10, 4363 (2010). 10.1021/nl101790k
39. A. J. Schmidt, R. Cheaito, and M. Chiesa, Rev. Sci. Instrum. 80, 094901 (2009). 10.1063/1.3212673
40. F. P. Incropera and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, 5th ed. (Wiley, 2002).
41. P. S. O. Patrício, H. D. R. Calado, F. A. C. de Oliveira, A. Righi, B. R. A. Neves, G. G. Silva, and L. A. Cury, J. Phys.: Condens. Matter 18, 7529 (2006). 10.1088/0953-8984/18/32/002
42. J. R. Olson, K. A. Topp, and R. O. Pohl, Science 259, 1145 (1993). 10.1126/science.259.5098.1145
43. M. T. Rispens, A. Meetsma, R. Rittberger, C. J. Brabec, N. S. Sariciftci, and J. C. Hummelen, Chem. Commun. 2116 (2003). 10.1039/B305988J
44. See supplementary material at http://dx.doi.org/10.1063/1.4812234 E-APPLAB-102-030326 for more information regarding the assumed heat capacities of PCBM.
45. C. Thomsen, J. Strait, Z. Vardeny, H. J. Maris, J. Tauc, and J. J. Hauser, Phys. Rev. Lett. 53, 989 (1984). 10.1103/PhysRevLett.53.989
46. C. Thomsen, H. T. Grahn, H. J. Maris, and J. Tauc, Phys. Rev. B 34, 4129 (1986). 10.1103/PhysRevB.34.4129
47. R. M. Costescu, M. A. Wall, and D. G. Cahill, Phys. Rev. B 67, 054302 (2003). 10.1103/PhysRevB.67.054302
48. A. J. Bullen, K. E. O'Hara, D. G. Cahill, O. Monteiro, and A. von Keudell, J. Appl. Phys. 88, 6317 (2000). 10.1063/1.1314301
49. J. C. Duda, P. E. Hopkins, Y. Shen, and M. C. Gupta, Phys. Rev. Lett. 110, 015902 (2013). 10.1103/PhysRevLett.110.015902
50. D. G. Cahill, personal communication (2013).
51. W. Yin and M. Dadmun, ACS Nano 5, 4756 (2011). 10.1021/nn200744q
52. B. Abeles, D. S. Beers, G. D. Cody, and J. P. Dismukes, Phys. Rev. 125, 44 (1962). 10.1103/PhysRev.125.44
53. R. Cheaito, J. C. Duda, T. E. Beechem, K. Hattar, J. F. Ihlefeld, D. L. Medlin, M. A. Rodriguez, M. J. Campion, E. S. Piekos, and P. E. Hopkins, Phys. Rev. Lett. 109, 195901 (2012). 10.1103/PhysRevLett.109.195901
54. R. Prasher, Proc. IEEE 94, 1571 (2006). 10.1109/JPROC.2006.879796