Origins of thermal boundary conductance of interfaces involving organic semiconductors

Journal of Applied Physics

Volumn 112, Issue 9, 2012, Pages

  Jin, Yansha ^a   Shao, Chen ^a   Kieffer, John ^a   Pipe, Kevin P ^a   Shtein, Max ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION TEST; BONDING STRENGTH; COPPER PHTHALOCYANINE; FREQUENCY REGIMES; INTERFACE BOND STRENGTH; INTERFACIAL BOND STRENGTH; MD SIMULATION; MOLECULAR DYNAMICS SIMULATIONS; ORGANIC LAYERS; PHONON DENSITY OF STATE; RELATIVE CONTRIBUTION; ROOM TEMPERATURE; THERMAL BOUNDARY CONDUCTANCE; THERMAL CONDUCTANCE; THERMAL TRANSPORT; VAN DER WAALS INTERACTIONS; WEAK BONDING;

ALUMINUM; BOND STRENGTH (MATERIALS); DIFFUSION BONDING; GOLD; MAGNESIUM; MOLECULAR DYNAMICS; SEMICONDUCTING ORGANIC COMPOUNDS; THERMAL CONDUCTIVITY; VAN DER WAALS FORCES;

INTERFACES (MATERIALS);

EID: 84870931826     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4759286     Document Type: Article

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