Experimental investigation of size effects on the thermal conductivity of silicon-germanium alloy thin films

Physical Review Letters

Volumn 109, Issue 19, 2012, Pages

  Cheaito, Ramez ^a   Duda, John C ^a,b   Beechem, Thomas E ^b   Hattar, Khalid ^b   Ihlefeld, Jon F ^b   Medlin, Douglas L ^c   Rodriguez, Mark A ^b   Campion, Michael J ^b,d   Piekos, Edward S ^b   Hopkins, Patrick E ^a  

^a University of Virginia   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

^c SANDIA NATIONAL LABORATORIES   (United States)

^d Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOY FILM; BOUNDARY SCATTERING; BULK VALUE; EPITAXIALLY GROWN; EXPERIMENTAL INVESTIGATIONS; FINITE SIZE EFFECT; HEAT CARRIERS; HEAT TRANSPORT; LONG WAVELENGTH; SAMPLE SIZES; SILICON GERMANIUM; SILICON-GERMANIUM ALLOYS; SIZE EFFECTS; TIME DOMAIN THERMOREFLECTANCE;

GERMANIUM; GERMANIUM ALLOYS; NANOSYSTEMS; SILICON; SIZE DETERMINATION; SUPERLATTICES; THIN FILMS;

THERMAL CONDUCTIVITY OF SOLIDS;

EID: 84869067491     PISSN: 00319007     EISSN: 10797114     Source Type: Journal    
DOI: 10.1103/PhysRevLett.109.195901     Document Type: Article

References (33)

1. G.J. Snyder and E.S. Toberer, Nature Mater. 7, 105 (2008). NMAACR 1476-1122 10.1038/nmat2090 (Pubitemid 351187650)
2. S.-M. Lee, D.G. Cahill, and R. Venkatasubramanian, Appl. Phys. Lett. 70, 2957 (1997). APPLAB 0003-6951 10.1063/1.118755
3. R. Venkatasubramanian, E. Siivola, and T. Colpitts, in Proceedings of the Seventeenth International Conference on Thermoelectrics (IEEE, New York, 1998), p. 191, http://ieeexplore.ieee.org/xpls/abs-all.jsp?arnumber=740350.
4. T. Borca-Tasciuc, W. Liu, J. Liu, T. Zeng, D.W. Song, C.D. Moore, G. Chen, K.L. Wang, and M.S. Goorsky, in Proceedings of the Eighteenth International Conference on Thermoelectrics (IEEE, New York, 1999), p. 201, http://ieeexplore.ieee.org/xpl/articleDetails.jsp?reload=true&arnumber= 843368&content=Conference+Publications.
5. T. Borca-Tasciuc, W. Liu, J. Liu, T. Zeng, D.W. Song, C.D. Moore, G. Chen, K.L. Wang, M.S. Goorsky, T. Radetic, R. Gronsky, T. Koga, and M.S. Dresselhaus, Superlattices Microstruct. 28, 199 (2000). SUMIEK 0749-6036 10.1006/spmi.2000.0900
6. S. Chakraborty, C.A. Kleint, A. Heinrich, C.M. Schneider, J. Schumann, M. Falke, and S. Teichert, Appl. Phys. Lett. 83, 4184 (2003). APPLAB 0003-6951 10.1063/1.1628819
7. S.T. Huxtable, A.R. Abramson, C.-L. Tien, A. Majumdar, C. LaBounty, X. Fan, G. Zeng, J.E. Bowers, A. Shakouri, and E.T. Croke, Appl. Phys. Lett. 80, 1737 (2002). APPLAB 0003-6951 10.1063/1.1455693 (Pubitemid 34635878)
8. G. Chen, S.Q. Zhou, D.-Y. Yao, C.J. Kim, X.Y. Zheng, Z.L. Liu, K.L. Wang, X. Sun, and M.S. Dresselhaus, in Proceedings of the Seventeenth International Conference on Thermoelectrics (IEEE, New York, 1998), p. 202, http://ieeexplore.ieee.org/xpls/abs-all.jsp?arnumber=740352.
9. D. Li, Y. Wu, R. Fan, P. Yang, and A. Majumdar, Appl. Phys. Lett. 83, 3186 (2003). APPLAB 0003-6951 10.1063/1.1619221
10. C.B. Vining, J. Appl. Phys. 69, 331 (1991). JAPIAU 0021-8979 10.1063/1.347717
11. G. Joshi, H. Lee, Y. Lan, X. Wang, G. Zhu, D. Wang, R.W. Gould, D.C. Cuff, M.Y. Tang, M.S. Dresselhaus, G. Chen, and Z. Ren, Nano Lett. 8, 4670 (2008). NALEFD 1530-6984 10.1021/nl8026795
12. X.W. Wang, H. Lee, Y.C. Lan, G.H. Zhu, G. Joshi, D.Z. Wang, J. Yang, A.J. Muto, M.Y. Tang, J. Klatsky, S. Song, M.S. Dresselhaus, G. Chen, and Z.F. Ren, Appl. Phys. Lett. 93, 193121 (2008). APPLAB 0003-6951 10.1063/1.3027060
13. G.A. Slack and M.A. Hussain, J. Appl. Phys. 70, 2694 (1991). JAPIAU 0021-8979 10.1063/1.349385
14. G. Chen and M. Neagu, Appl. Phys. Lett. 71, 2761 (1997). APPLAB 0003-6951 10.1063/1.120126
15. A.A. Kiselev, K.W. Kim, and M.A. Stroscio, Phys. Rev. B 62, 6896 (2000). PRBMDO 0163-1829 10.1103/PhysRevB.62.6896 (Pubitemid 32323571)
16. S. Volz, J.B. Saulnier, G. Chen, and P. Beauchamp, Microelectron. J. 31, 815 (2000). MICEB9 0026-2692 10.1016/S0026-2692(00)00064-1
17. E.S. Landry and A.J.H. McGaughey, Phys. Rev. B 79, 075316 (2009). PRBMDO 1098-0121 10.1103/PhysRevB.79.075316
18. D.P. Sellan, E.S. Landry, J.E. Turney, A.J.H. McGaughey, and C.H. Amon, Phys. Rev. B 81, 214305 (2010). PRBMDO 1098-0121 10.1103/PhysRevB.81.214305
19. J. Chen, G. Zhang, and B. Li, Appl. Phys. Lett. 95, 073117 (2009). APPLAB 0003-6951 10.1063/1.3212737
20. A. Skye and P.K. Schelling, J. Appl. Phys. 103, 113524 (2008). JAPIAU 0021-8979 10.1063/1.2936868
21. J. Garg, N. Bonini, B. Kozinsky, and N. Marzari, Phys. Rev. Lett. 106, 045901 (2011). PRLTAO 0031-9007 10.1103/PhysRevLett.106.045901
22. D.G. Cahill, A. Bullen, and S.-M. Lee, High Temp. High Press. 32, 135 (2000). HTHPAK 0018-1544 10.1068/htwi9
23. Y.K. Koh and D.G. Cahill, Phys. Rev. B 76, 075207 (2007). PRBMDO 1098-0121 10.1103/PhysRevB.76.075207
24. P.E. Hopkins, J.R. Serrano, L.M. Phinney, S.P. Kearney, T.W. Grasser, and C.T. Harris, J. Heat Transfer 132, 081302 (2010). JHTRAO 0022-1481 10.1115/1.4000993
25. D.G. Cahill, K. Goodson, and A. Majumdar, J. Heat Transfer 124, 223 (2002). JHTRAO 0022-1481 10.1115/1.1454111 (Pubitemid 34416290)
26. A.J. Schmidt, X. Chen, and G. Chen, Rev. Sci. Instrum. 79, 114902 (2008). RSINAK 0034-6748 10.1063/1.3006335
27. D.G. Cahill, Rev. Sci. Instrum. 75, 5119 (2004). RSINAK 0034-6748 10.1063/1.1819431 (Pubitemid 40817987)
28. C. Thomsen, J. Strait, Z. Vardeny, H.J. Maris, J. Tauc, and J.J. Hauser, Phys. Rev. Lett. 53, 989 (1984). PRLTAO 0031-9007 10.1103/PhysRevLett.53.989
29. C. Thomsen, H.T. Grahn, H.J. Maris, and J. Tauc, Phys. Rev. B 34, 4129 (1986). PRBMDO 0163-1829 10.1103/PhysRevB.34.4129
30. H.-M. Kagaya, Y. Kitani, and T. Soma, Solid State Commun. 58, 399 (1986). SSCOA4 0038-1098 10.1016/0038-1098(86)90814-8 (Pubitemid 16565522)
31. Z. Wang and N. Mingo, Appl. Phys. Lett. 97, 101903 (2010). APPLAB 0003-6951 10.1063/1.3486171
32. D.G. Cahill, F. Watanabe, A. Rockett, and C.B. Vining, Phys. Rev. B 71, 235202 (2005). PRBMDO 1098-0121 10.1103/PhysRevB.71.235202 (Pubitemid 41717842)
33. C.Y. Ho, R.W. Powell, and P.E. Liley, J. Phys. Chem. Ref. Data 1, 279 (1972). JPCRBU 0047-2689 10.1063/1.3253100