Ultra high aspect ratio penetrating metal microelectrodes for biomedical applications

Microsystem Technologies

Volumn 19, Issue 2, 2013, Pages 179-186

  Kamaraj, Abishek B ^a   Sundaram, Murali M ^a   Mathew, Ronnie ^a  

^a University of Cincinnati   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BIOCOMPATIBILITY; COCHLEAR IMPLANTS; ELECTRIC DISCHARGE MACHINING; ELECTROCHEMICAL CUTTING; MACHINING CENTERS; MEDICAL APPLICATIONS; MICROELECTRODES; SURFACE ROUGHNESS;

BIOMEDICAL APPLICATIONS; COCHLEAR IMPLANT ELECTRODES; ELECTROCHEMICAL MACHINING; FABRICATION PROCESS; MANUFACTURING PROCEDURE; PHYSICAL CONDITIONS; SILICON-BASED MATERIALS; SURFACE ROUGHNESS (RA);

ASPECT RATIO;

EID: 84878551875     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-012-1653-3     Document Type: Article

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